Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN SS515(SMA)
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SS515(SMA)
- Type
- BORN
- Minimum package
- 5000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SS515(SMA)
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.124g
- Electronic Component
- 1
- Electronic Component
- BM0264682191
- Current
- 5A
- Diode
- 1
- Current(Ir)
- 950uA
- (Vf)
- 550mV@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS515 (SMA) 产品概述
一、主要参数
SS515 为 BORN（伯恩半导体）推出的独立式整流二极管（SMA 封装，JEDEC DO-214AC）。关键电气参数：正向压降 Vf = 550 mV（5 A 测试条件）、直流反向耐压 Vr = 150 V、整流电流 If(AV) = 5 A、反向电流 Ir = 950 μA。工作结温范围为 -55 ℃ 至 +150 ℃。极性以色带标示阴极，安装方向不受限制。
二、结构与封装
器件采用 DO-214AC（SMA）模制塑料外壳，耐用且利于自动化贴装。引脚为轴向引线设计，满足 MIL-STD-750 方法 2026 的可焊接性要求。外壳小巧，适合空间受限的功率整流应用，热阻需通过 PCB 铜箔进行散热管理。
三、电气性能特点
- 低正向压降：在 5 A 工作点 Vf 约 0.55 V，减小导通损耗，提升效率。
- 中等反向耐压：150 V 满足常见整流与保护场景。
- 反向漏电：Ir ≈ 950 μA，需在高温或对漏电敏感的电路中评估。
- 宽温工作：可在 -55 ℃ 至 +150 ℃ 的结温范围内稳定工作，适用环境温差较大的设备。
四、热与可靠性
SMA 封装本身散热受限，器件持续 5 A 工作时产生的功耗需通过 PCB 加大散热铜箔、热沉或过孔阵列导出。推荐依据实际功耗计算结温并留安全裕量。封装符合 JEDEC 标准，焊接可靠性通过工业方法验证。
五、典型应用
- 开关电源整流输出
- 充电器、适配器的整流与保护
- 反向电流保护与整流桥组件
- 电机驱动、功率模块的快恢复整流场合（需评估恢复时间与系统需求）
六、安装与焊接要点
- 推荐按 SMA 的 PCB 焊盘布局并增大铜面积以便散热。
- 引脚和端子符合 MIL-STD-750 方法 2026，可采用波峰焊或回流焊工艺（参考具体焊接曲线）。
- 极性明确，色带为阴极标识，装配时注意方向。
- 存储与焊接前防潮处理按常规半导体器件要求执行。
七、选型与使用注意
选型时关注实际工作电流、脉冲峰值和工作温度对 Vf 与 Ir 的影响。若应用对反向漏电或反向恢复特性敏感，建议参考完整数据表或与厂商确认更详细的动态参数。SS515 在尺寸、成本与性能之间提供良好平衡，适合多数中等功率整流与保护场景。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
