WMSIC Electronic Components

BORN SMBJ12A

ModelSMBJ12A
PackageDO-214AA(SMB)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMBJ12A
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMBJ12A
Electronic Component
1
Package
DO-214AA(SMB)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0225200478
Voltage
19.9V
Current(Ir)
1uA
Voltage(VBR)
13.3V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMBJ12A 产品概述

一、产品概述

SMBJ12A 是 BORN(伯恩半导体)出品的一款单向瞬态电压抑制二极管(TVS/ESD),封装为 DO-214AA(SMB),用于对瞬态过电压、静电放电和浪涌脉冲提供可靠钳位保护。器件专为 12V 工作电压档位的电源和信号线保护设计,适合汽车电子、通信设备、工业控制、电源模块等需要抗浪涌和抗ESD的场合。

二、主要参数

  • 类型:TVS(二极管型,单向)
  • 反向截止电压 Vrwm:12V(推荐最大工作电压)
  • 击穿电压(V_BR):13.3V(测量条件下)
  • 钳位电压 V_C:19.9V(对应脉冲测试)
  • 峰值脉冲功率 Ppp:600W(10/1000 μs 波形)
  • 峰值脉冲电流 Ipp:30.2A(与 Ppp、V_C 对应)
  • 反向电流 Ir:1 μA(在 Vrwm 条件下)
  • 极性:单向(正向导通时对地钳位)
  • 封装:DO-214AA(SMB)
  • 品牌:BORN(伯恩半导体)

三、工作原理与保护能力

SMBJ12A 在正常工作时呈高阻状态,反向电压小于 Vrwm(12V)时仅有微小泄漏电流(Ir≈1μA)。当系统出现浪涌或瞬态过电压,器件进入雪崩击穿区(V_BR≈13.3V),并在规定的脉冲条件下将浪涌电压钳位到约 19.9V,从而保护后级电路免受高电压破坏。600W 的 10/1000 μs 能量能力说明其能吸收较长时间、较大能量的浪涌脉冲,单次峰值电流可达约 30.2A。

四、典型应用场景

  • 车载 12V 电源线和通信线防护(车内电子、娱乐系统、传感器接口)
  • 通信设备(基站、电源分配、以太网端口的防护)
  • 工业控制和自动化设备的输入/输出端口
  • 电源适配器、开关电源对突发浪涌和关断尖峰的抑制
  • 任何需要在 12V 工作电压附近提供稳健瞬态保护的场合

五、安装与使用建议

  • 极性注意:单向 TVS 在正常电源极性下应反向连接(即阴极接电源正,阳极接地),以保证过压时能及时钳位。
  • 封装与散热:DO-214AA(SMB)为中等尺寸封装,焊盘设计需保证良好散热和机械支撑,长时间或重复浪涌时注意 PCB 热管理。
  • 焊接工艺:遵循厂家推荐的回流/波峰焊温度曲线,避免过热造成封装和电气特性变化。
  • 环境与老化:在高温、高湿或强腐蚀环境中应评估长期泄漏和可靠性,必要时考虑增加外部滤波或冗余保护。

六、选型要点与注意事项

  • 工作电压裕量:确保 Vrwm(12V)高于设备正常最大工作电压,但与器件击穿电压保持合适余量,通常选型时留 10–20% 余量。
  • 钳位电压影响负载:钳位电压 19.9V 在被保护电路能承受的范围内,否则需选用钳位更低或并联其他保护方案。
  • 脉冲形式与能量:600W@10/1000 μs 适用于较长时间的浪涌脉冲;若系统遭受短时高能冲击(如雷击近距离),需评估是否需要更大能量等级或级联保护。
  • 单向 vs 双向:单向适合直流系统;交流或双向瞬态需考虑双向 TVS。

七、包装与品牌信息

BORN(伯恩半导体)提供此型号器件的标准封装和批量供应,SMBJ12A 采用 DO-214AA(SMB)封装,便于通过孔焊接或手工装配。选购时请确认器件的批次、静电保护和储运条件,以免在装配过程中损坏敏感元件。

总之,SMBJ12A 针对 12V 等级系统提供高效、可靠的瞬态抑制能力,适合广泛的工业与汽车电子应用。选型时综合考虑工作电压余量、钳位电压允许范围及脉冲能量需求,可实现稳健的过电压防护。

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