WMSIC Electronic Components

BORN SMD2920-700/16N

ModelSMD2920-700/16N
Package2920
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD2920-700 / 16N
Type
BORN
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD2920-700/16N
Electronic Component
1
Electronic Component
5.44mm
Package
2920
Electronic Component
Resettable Fuse
Electronic Component
0.275g
Electronic Component
7.98mm
Electronic Component
1.6mm
Electronic Component
1
Electronic Component
2s
Electronic Component
BM0258713081
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
2W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD2920-700/16N 产品概述

一、产品简介

SMD2920-700/16N 是 BORN(伯恩半导体)推出的一款表面贴装型自恢复熔断器(PTC/Polymeric Fuse),封装尺寸为 2920(7.98mm × 5.44mm × 1.6mm)。该器件用于对过流与短路情况提供过载保护,具有快速动作与自恢复能力,适用于对空间与可靠性有要求的电子系统。

二、关键参数

  • 额定耐压(Vmax):16 V
  • 最大持续电流(Imax):40 A
  • 保持电流(Ihold):7 A
  • 跳闸电流(Itrip):14 A
  • 动作时间(至跳闸):约 2 s
  • 在常态下电阻(Rmin):2.5 mΩ
  • 跳断后最大阻值(R1max):18 mΩ
  • 功耗(Pd):2 W
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装尺寸:7.98 mm × 5.44 mm × 1.6 mm

三、主要特点

  • 过流保护精确:Ihold 与 Itrip 值明确,便于设计中可靠预测动作点。
  • 低初始阻值:Rmin = 2.5 mΩ,电压降小,适合大电流路径。
  • 自恢复能力:过载解除后可恢复导通,减少维护与更换成本。
  • 工作温度宽:适应工业级环境(-40 ℃ 至 +85 ℃)。
  • 封装紧凑:2920 尺寸适合 SMD 贴装与回流焊工艺。

四、典型应用场景

  • 移动电源与便携设备的电池保护
  • 电源模块、DC-DC 变换器与车载电子(16 V 以内)过流保护
  • 工业控制与通信设备的输入侧保护
  • 需要自动复位保护的消费电子与家电产品

五、选型与使用建议

  • 额定电流匹配:正常工作电流应明显低于 Ihold(7 A)以避免误动作;峰值电流若短时高于 Ihold,应确保不超过 Itrip 持续时间限制或考虑并联/更高规格件。
  • 考虑发热与功耗:在接近 Ihold 的工作点,器件会有一定发热,设计 PCB 时应留有散热空间并避免在高温环境下并联使用。
  • 起始电阻与电压降:2.5 mΩ 的低 Rmin 优势明显,但在大电流场合仍需评估功率损耗(I^2R)。
  • 多器件并联:若需更大承载能力,应采用规范并联方案并考虑均流问题,不建议简单并联以求提升额定电流。

六、封装与安装注意事项

  • 推荐使用标准回流焊工艺,遵循厂商的焊接温度与时间曲线以确保可靠性。
  • PCB 焊盘设计应兼顾机械支撑与热散,避免因应力或热循环导致焊点开裂。
  • 储存与贴装前避免受潮,必要时按标准回流前进行干燥处理。

七、可靠性与品质提示

BORN 品牌产品通常通过寿命与循环测试,适合长期使用。但在高温、高湿或频繁过载场景,应进行验证测试(热循环、耐压及过流重复动作试验)以确认系统级可靠性。

总结:SMD2920-700/16N 以其低阻、明确的动作特性和自恢复能力,适合作为 16 V 等级下要求自动复位与高可靠性的过流保护器件。在选型与布局时关注额定电流裕量、散热与焊接工艺,可获得稳定、长期的保护性能。

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