WMSIC Electronic Components

BORN 1.5SMBJ30CA

Model1.5SMBJ30CA
PackageDO-214AA(SMB)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN 1.5SMBJ30CA
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
1.5SMBJ30CA
Electronic Component
1
Package
DO-214AA(SMB)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.24g
Electronic Component
1
Electronic Component
BM0229259077
Voltage
48.4V
Current(Ir)
1uA
Voltage(VBR)
33.3V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1.5SMBJ30CA 产品概述

一、概述与主要参数

1.5SMBJ30CA 是一款双向瞬态抑制二极管(TVS),由 BORN(伯恩半导体)提供,封装为 DO-214AA(SMB)。该器件针对瞬态浪涌和静电放电(ESD)保护而设计,适用于 30V 等级的电源线和信号线保护。主要电气参数如下:

  • 极性:双向
  • 反向截止电压 Vrwm(稳态耐压):30 V
  • 击穿/崩溃电压(Vbr):约 33.3 V
  • 钳位电压(Vc):48.4 V @ Ipp = 31 A
  • 峰值脉冲电流 Ipp:31 A
  • 峰值脉冲功率 Ppp:1.5 kW(典型 10/1000 μs 测试波形)
  • 反向漏电流 Ir:1 μA(典型)
  • 封装:DO-214AA(SMB)

二、关键特性与优势

  • 双向配置,可对正负极性瞬态进行对称钳位,适合交流或可反向的线路保护。
  • 高峰值脉冲功率(1.5 kW)可吸收较大能量的浪涌事件,如雷击感应浪涌与工业浪涌。
  • 低反向漏电(~1 μA),在稳态工作下对系统影响微小,适用于对静态功耗敏感的电路。
  • 钳位电压 48.4 V(31 A 条件)能在强烈冲击时有效限制过压,保护下游器件不被击穿。

三、典型应用场景

  • 车载电子 24 V/30 V 线路的浪涌保护(需要检查车规等级与温度能力)。
  • 开关电源输入、直流分配总线的浪涌抑制。
  • 通讯接口、工业控制端口的 ESD 与浪涌防护。
  • 适用于需要双向保护的电力电子与逆变器辅助电路。

四、选型与设计要点

  • Vrwm(30 V)应大于或等于被保护线路的最大工作电压;若线路存在较大浪涌或瞬态幅度,考虑选择更高 Ppp 或并联多个器件以分担能量。
  • 钳位电压决定保护能力对下游器件的应力:48.4 V 在 31 A 冲击下表明在大电流冲击时仍能将电压限制在可接受范围内,但需确认被保护器件的最高承受电压。
  • 峰值脉冲功率 1.5 kW 是基于标准测试波形(通常为 10/1000 μs)给出的额定值;不同波形下能量吸收能力会有差异,应按实际冲击波形评估。
  • 漏电随温度上升而增加,设计时注意留出足够的功耗和热裕量。

五、封装与 PCB 布局建议

  • DO-214AA(SMB)封装便于自动贴装与波峰/回流焊接,适合中等功率应用。
  • 布局时将 TVS 放置在被保护端口附近,输入到 TVS 的走线应尽量短且宽,以降低阻抗和串联电感,提高钳位效率。
  • 为了散热,应保证封装底部与 PCB 铜箔有良好热连接,必要时增加散热铜面积或使用热过孔导热。
  • 对于高重复冲击环境,考虑在 PCB 上预留更大焊盘或加固措施以提高机械可靠性。

六、可靠性与使用注意

  • 该器件能承受单次或少量大能量脉冲;对于频繁的大能量冲击,应评估寿命与累积损伤,必要时采用并联或选用更高能量等级器件。
  • 在高温环境下,漏电流和钳位性能会变化,长期工作前应参考完整数据手册的温度特性曲线。
  • 出货前检查焊接规范与湿敏等级,遵循厂家推荐的回流焊工艺以避免热损伤。

七、采购与替代

  • 型号:1.5SMBJ30CA,品牌:BORN(伯恩半导体),封装:DO-214AA(SMB)。
  • 选型时可参考同类 1.5SMBJ 系列中不同标称 Vrwm 的型号,或在需要更高能量处理能力时选用更高 Ppp 等级的 TVS。

总结:1.5SMBJ30CA 为一款面向 30 V 等级线路的双向 TVS,具备 1.5 kW 的瞬态功率处理能力和较低漏电,适合用于中等能量浪涌与 ESD 保护场景。在具体应用中,请结合实际冲击波形、环境温度和系统电压余量进行完整评估,并参考厂商完整数据手册以获取温度特性、机械尺寸和焊接工艺等详细信息。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.