Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN MMBT3904T
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN MMBT3904T
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- MMBT3904T
- Electronic Component
- 1
- Package
- SOT-523
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0226525774
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT3904T 产品概述
一、概述
MMBT3904T 是一款由 BORN（伯恩半导体）推出的低功耗小信号 NPN 晶体管，封装为 SOT-523，适合高密度表面贴装电路。器件在低电流工作点下表现出稳定的直流电流增益，且具备较高的频率特性与耐压能力，适用于微弱信号放大、开关和驱动等通用场合。
二、主要参数
- 晶体管类型：NPN
- 直流电流增益 (hFE)：40 @ Ic=0.1mA, VCE=1V
- 集电极电流 (Ic)：最大 200mA（连续）
- 集电极击穿电压 (Vceo)：40V
- 耗散功率 (Pd)：150mW
- 集电极截止电流 (Icbo)：50nA（典型/最大值视测试条件而定）
- 射基极击穿电压 (Vebo)：6V
- 特征频率 (fT)：300MHz（适合高频小信号放大）
- 集射极饱和电压 (VCE(sat))：约 300mV @ Ic=50mA 或 5mA（具体随偏流变化）
三、性能特点
- 小封装（SOT-523），适合空间受限和高密度布板设计。
- 低静态功耗与中等增益，便于偏置与稳定工作。
- 高频特性良好（fT≈300MHz），适合中高频放大电路。
- 耐压 40V，可应对常见信号与驱动电压环境。
- 宽工作温度范围：-55℃ 至 +150℃，适用于工业级温度要求。
四、典型应用
- 小信号放大器、前置放大、射频低功率放大。
- 开关电路、驱动小型继电器或指示灯（注意功耗和饱和压降）。
- 电平移位、缓冲器、数字电路接口。
- 高密度消费电子、便携设备、传感器前端等应用。
五、布局与散热建议
- SOT-523 封装热阻较大，应注意版面铜箔扩展以改善散热。
- 在集电极或与器件热路径相连的铜箔上增加散热面积，可提高 Pd 的实际承载能力。
- 对于需长期大电流（接近 Icmax）应用，应进行热仿真并留裕量，避免长期工作在高结温下影响可靠性。
六、选型与使用注意
- 依据实际工作电流、功耗与频率要求选择器件，若工作电流持续偏高建议选用功耗更高的封装或并联设计。
- 关注 Vebo（6V）以防止基极反向过压损坏。
- 进行静电防护（ESD）处理，SOT-523 器件针脚小，搬运与焊接时宜使用防静电措施。
- 推荐在实际电路中做器件级测试以确认 hFE、VCE(sat) 等对系统性能的影响。
如需封装尺寸图、典型电路、或与其它封装/参数器件的对比，我可提供进一步资料与选型建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
