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BORN ES1J
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN ES1J
- Type
- BORN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- ES1J
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.105g
- Electronic Component
- 1
- Electronic Component
- BM0209752157
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA@600V
- (Vf)
- 1.7V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES1J 通用整流二极管（BORN 伯恩半导体）产品概述
一、主要参数
- 型号：ES1J
- 品牌：BORN（伯恩半导体）
- 封装：SMA (DO-214AC)，适用于卷带贴片自动装配
- 直流反向耐压 Vr：600 V
- 正向压降 Vf：1.7 V @ IF = 1 A
- 整流电流 IF(AV)：1 A（连续）
- 非重复峰值浪涌电流 Ifsm：30 A
- 反向电流 IR：5 μA @ VR = 600 V
- 工作结温范围 Tj：-55 ℃ ~ +150 ℃
二、性能亮点
ES1J 是一款面向通用整流和保护用途的硅整流二极管。在高达600 V 的反向耐压下保持极低的漏电流（5 μA），适合高压环境中做整流或反向保护使用。1.7 V 的正向压降在 1 A 工作点下表现稳定，对温升和功耗有可预测性；30 A 的峰值浪涌能力能应对短时峰值冲击或浪涌电流。
三、典型应用
- 开关电源、功率适配器的输出整流
- 工业电源、整流模块与逆变器前端保护
- 过压/反接保护电路、极性防护
- 家电与照明驱动电源中的通用整流任务
四、热与可靠性建议
在 1 A 连续工作且 Vf≈1.7 V 时，器件约产生 1.7 W 的功耗，需要合理的 PCB 散热设计：增大铜箔面积、采用散热铜垫或靠近散热体布置。长期可靠性建议避免在高结温区长期工作，并按制造商提供的结温-电流降额曲线进行设计。浪涌电流规格表明可短时承受较大冲击，但不宜作为长期过载手段。
五、封装与装配注意
SMA（DO-214AC）为常见的表面贴装封装，便于自动化贴装与回流焊；实际回流工艺、焊盘尺寸及焊锡类型请参考厂方 PCB 推荐焊盘与回流曲线，以避免焊接应力或热损伤。储存和搬运注意防潮与防静电。
六、选型建议
需要高压、低漏电且可承受短时浪涌的通用整流场合，ES1J 是经济且可靠的选择。若对正向压降或开关损耗有更严格要求，可考虑肖特基或快恢复系列；对更大持续电流需求则应选用更高 IF(AV) 级别或并联设计，并评估热降额。
备注：本文基于提供的主要参数进行概述，具体电气特性曲线、结温-电流降额、脉冲响应和回流工艺参数，请以 BORN（伯恩半导体）正式数据手册为准。
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