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BORN SMD0805-020/09N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMD0805-020 / 09N
- Type
- BORN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMD0805-020/09N
- Electronic Component
- 1
- Electronic Component
- 1.5mm
- Package
- 0805
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.032g
- Electronic Component
- 2.2mm
- Electronic Component
- 0.8mm
- Electronic Component
- 1
- Electronic Component
- 20ms
- Electronic Component
- BM0263572185
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 9V
- Power(Pd)
- 500mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMD0805-020/09N 产品概述
一、产品概述
SMD0805-020/09N 是 BORN（伯恩半导体）推出的一款微型表面贴装自恢复保险元件（PPTC/聚合物自恢复保险丝），采用 0805 封装，尺寸 2.2mm × 1.5mm × 0.8mm，专为便携设备与高密度 PCB 的过流保护设计。器件在过流后自动跳闸并在故障解除后恢复导通，便于重复使用与维护。
二、主要技术参数
- 耐压（Vmax）：9 V
- 最大电流（Imax）：30 A（短时冲击能力）
- 保持电流（Ihold）：200 mA（长期不动作的最大电流）
- 跳闸电流（Itrip）：500 mA（在规定时间内动作）
- 动作时间：≈20 ms（达到 Itrip 时典型动作时间）
- 初始态阻值（Rmin）：550 mΩ
- 跳断后阻值（R1max）：3.5 Ω
- 消耗功率（Pd）：500 mW
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装：0805（SMD）
三、产品特性与优势
- 小尺寸：0805 封装适配高密度贴片设计，节省 PCB 面积。
- 快速保护：典型动作时间约 20 ms，能迅速限制故障电流，保护上游器件。
- 可复位：过流解除后自动恢复导通，降低维修成本。
- 耐冲击电流：支持高达 30 A 的短时冲击，适合含突发负载的系统。
- 宽工作温度：-40~85 ℃ 适配工业级环境。
四、典型应用
- 手机、平板、可穿戴设备、蓝牙耳机等便携终端的电源与充电口过流保护。
- 摄像头模块、传感器和微控制器电源保护。
- USB、Type-C、电池管理与电源分配系统的短路/过流防护。
- LED 驱动和小功率电源轨保护。
五、选型与使用建议
- 常规工作电流应低于 Ihold（200 mA），并留足裕量以避免因温升或环境变化导致误动作。
- 注意瞬时浪涌应小于 Imax（30 A），可通过软启动或限流设计降低冲击。
- 板级布局：焊盘尺寸与过孔应参考厂商推荐的 0805 尺寸，保证良好散热与焊接可靠性。
- 回流焊温度与时长遵循工业级 SMD 焊接工艺，避免超过器件最大回流温度。
- 对于关键可靠性应用，建议索取并参考厂家的完整动作曲线（I–t 曲线）与循环寿命测试报告。
六、包装与订购
- 标准 0805 SMD 贴片包装，支持卷带供料，便于 SMT 贴装。
- 订购时请确认完整型号 SMD0805-020/09N 并咨询 BORN 官方数据手册以获取更详尽的电气特性与可靠性数据。
如需所选型号的 I–t 曲线、热阻或推荐焊盘尺寸图，可提供具体电路工作电流与环境信息，我可协助核算与验证。
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