Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN USBLC6-4SC6
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN USBLC6-4SC6
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- USBLC6-4SC6
- Electronic Component
- 1
- Package
- SOT-23-6
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.039g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 0.2pF；0.36pF
- Electronic Component
- BM0230041455
- Voltage
- 13V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 500nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
USBLC6-4SC6 产品概述
一、产品简介
USBLC6-4SC6 是伯恩半导体（BORN）推出的一款单路单向ESD浪涌保护器，封装为 SOT-23-6。器件针对高速接口（如 USB）设计，具有极低的结电容（典型 0.2–0.36 pF），可在不显著影响信号完整性的前提下提供可靠的静电和浪涌防护。
二、主要性能参数
- 极性：单向
- 反向工作电压 Vrwm：5 V
- 击穿电压（典型）：7.8 V
- 钳位电压（典型）：13 V
- 峰值脉冲电流 Ipp：3.5 A（8/20 μs）
- 峰值脉冲功率 Ppp：60 W（8/20 μs）
- 反向漏电流 Ir：500 nA
- 通道数：单路
- 结电容 Cj：0.2 pF ~ 0.36 pF
- 防护等级兼容：IEC 61000-4-2（ESD）、IEC 61000-4-4（EFT）、IEC 61000-4-5（浪涌）
三、产品特点与优势
- 低结电容：对高速差分信号影响极小，适配 USB/High‑Speed/Full‑Speed 等接口。
- 快速响应：对瞬态静电放电和脉冲浪涌响应迅速，能在瞬时将过压钳位到安全水平。
- 紧凑封装：SOT-23-6 体积小，便于在空间受限的移动设备与外围接口处布局。
- 低漏电流：500 nA 的低反向漏电流保证在待机或低功耗模式下对系统影响小。
- 工业标准兼容：通过 IEC 61000-4-2/4/5 等测试项，适合商用及工业环境的抗扰度要求。
四、典型应用场景
- USB 接口（Type‑A/Type‑C）保护
- 移动终端、平板、笔记本外设接口的 ESD 与浪涌防护
- 工业控制器、人机界面（HMI）及其他需抗静电的高速信号输入端口
五、布局与使用建议
- 将器件尽量靠近受保护的器件连接点或外部接口放置，缩短输入线到 TVS 的走线长度以提高抑制效果。
- GND 引脚应尽量通过短、粗的回流结构连接至系统接地，并使用多过孔（vias）降低回流阻抗。
- 对于高速差分对，保证走线长度一致并避免在 TVS 附近产生不必要的串扰。
- 设备为敏感元件，请按制造商的防潮等级与回流焊工艺指南进行贴装与回流焊接。
六、包装与选型注意
USBLC6-4SC6 提供 SOT-23-6 封装，适合自动贴装生产。选型时请确认所需通道数与极性（单向）符合系统需求，注意器件的钳位电压与系统耐压裕度匹配，确保在浪涌/ESD 事件下保护器不会触发误动作或损坏被保护器件。
如需详细的电气特性曲线、钳位性能随电流变化图或封装/焊盘尺寸，请参考伯恩半导体的完整数据手册或联系供应商获得样片与评估资料。
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