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BORN SMD0603-035/06N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMD0603-035 / 06N
- Type
- BORN
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMD0603-035/06N
- Electronic Component
- 1
- Electronic Component
- 1.05mm
- Package
- 0603
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.043g
- Electronic Component
- 1.85mm
- Electronic Component
- 0.9mm
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0264692204
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 500mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMD0603-035/06N 产品概述
一、产品简介
SMD0603-035/06N 是 BORN（伯恩半导体）推出的一款 0603 封装自恢复型过流保护元件（PPTC/保险式复位器件）。该器件专为低压、低电流电子系统提供过流保护，发生故障时自动限流并在故障解除后恢复正常，适合空间受限的表面贴装应用。
二、主要技术参数
- 额定耐压（Vmax）：6 V
- 最大脉冲电流（Imax）：35 A
- 保持电流（Ihold）：350 mA
- 跳闸电流（Itrip）：750 mA
- 功耗（Pd）：500 mW
- 初始态阻值（Rmin）：200 mΩ
- 跳断后阻值（R1max）：1 Ω
- 动作时间：100 ms
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装尺寸：0603（长 1.85 mm × 宽 1.05 mm × 高 0.9 mm）
- 品牌：BORN（伯恩半导体）
三、主要特性与优势
- 小型化封装：0603 大小，适合高密度 PCB 布局，节省空间。
- 自恢复保护：发生过流或短路时迅速升阻限流，故障消除后自动恢复无需更换。
- 快速动作：典型动作时间约 100 ms，可有效保护下游元件。
- 宽温度范围：适用于消费电子、通信及工业级温度要求的场合。
- 低初始阻值：200 mΩ 起始阻抗，正常工作时对电路影响小。
四、典型应用场景
- 移动设备与可穿戴设备的 USB 及外围供电保护。
- 摄像头模组、传感器模块等小型消费电子外设。
- 工业控制板、物联网终端的局部过流保护。
- 电源输入或保护回路中作为二次保护元件。
五、封装与安装注意事项
- 建议按厂商推荐的 PCB 焊盘尺寸进行贴装，控制回流焊温度曲线以防器件受热损伤。
- 0603 体积小，焊接与回流过程需注意机械应力与焊膏量，避免开路或焊点虚焊。
- 与热源或大电流器件保持一定距离，利于散热与性能稳定。
六、热与可靠性考虑
- 标称 Pd=500 mW，须注意长期额定功耗与环境温升关系，过高的稳态功耗会导致器件进入高阻态。
- Imax 为最大脉冲/冲击能力，非长期连续电流，设计时应以 Ihold 与 Itrip 为保护参考值。
- 在高温或连续高负载下，器件的动作点和恢复时间会发生漂移，应通过热仿真与实际测试验证。
七、选型建议与替代
- 若系统工作电压或工作电流高于本件额定值，应选择更高电压/电流等级的同类产品。
- 对瞬态浪涌有较高要求时，考虑在前端增加 TVS 二极管或熔断器与本件配合使用，形成多层保护。
- 始终参照 BORN 官方数据手册验证温度系数、冲击能力与可靠性数据。
八、结论
SMD0603-035/06N 以其超小型封装与自恢复过流保护特性，适合对空间与可靠性要求较高的低压电源与信号保护场合。在实际设计中需关注热管理与回流焊工艺，并根据系统的持续电流与浪涌要求合理选型与配套保护元件。若需更详细的电气曲线或 PCB 布局建议，建议查阅厂商完整规格书或联系 BORN 技术支持。
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