WMSIC Electronic Components

BORN BSD3C081V

ModelBSD3C081V
PackageSOD-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BSD3C081V
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BSD3C081V
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.1g
Electronic Component
1
Cj- Capacitor
45pF
Electronic Component
BM0227161500
Voltage
27V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
9V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSD3C081V 产品概述

一、产品简介

BSD3C081V 是来自 BORN(伯恩半导体)的一款小型 SOD-323 封装的双向瞬态电压抑制器(TVS/ESD)。该器件专为静电放电(ESD)和浪涌(Surge)保护设计,适用于对 PCB 空间要求高且需要可靠浪涌保护的消费类及工业电子设备。

二、主要参数

  • 极性:双向(适用于交流或差分信号线)
  • 反向工作电压 Vrwm:8 V
  • 击穿电压 Vbr:9 V(典型)
  • 钳位电压 Vc:27 V(典型)
  • 峰值脉冲电流 Ipp:15 A(8/20 μs 波形)
  • 峰值脉冲功率 Ppp:400 W(8/20 μs)
  • 反向漏电流 Ir:1 μA(在 Vrwm 条件下)
  • 结电容 Cj:45 pF
  • 防护等级:符合 IEC 61000-4-2 / 4-4 / 4-5 标准

三、产品特点

  • 双向结构,可直接并联在差分信号对或电源线上,提供正负向过压保护。
  • 高峰值冲击能力(15 A@8/20 μs,400 W),在典型浪涌事件中提供可靠钳位。
  • 低漏电流(1 μA),对待测电路的静态功耗影响极小。
  • 小尺寸 SOD-323 封装,便于在紧凑电路板上布局。

四、典型应用场景

  • 接口保护:USB、串口、GPIO 等低中速差分/单端信号线。
  • 电源防护:小功率供电轨的瞬态浪涌抑制。
  • 工业与消费电子:控制模块、传感器接口、显示与多媒体设备。
  • 可在有 IEC 61000 系列 ESD/浪涌要求的系统中作为第一道保护元件。

五、选型与布局建议

  • 结电容 45 pF 对高速差分总线(如高速 USB/HDMI)可能影响信号完整性,推荐用于低至中速信号或电源线保护。
  • 放置位置应尽量靠近被保护器件的输入端或接口处,焊盘到器件的导线/走线长度越短越好,以减小寄生感抗。
  • 对需要更高能量吸收或更低钳位的应用,可考虑并联或级联其他浪涌保护器件,但需评估热与触发特性匹配。

六、封装与焊接

SOD-323 小体积封装,支持常规回流焊工艺。焊接时保持焊盘设计与热特性匹配,避免长时间过热。建议遵循器件供应商的回流温度曲线与PCB焊盘推荐。

七、订购信息

型号:BSD3C081V
品牌:BORN(伯恩半导体)
封装:SOD-323
在选购与替换时,请确认 Vrwm、钳位电压、Ipp 与结电容等关键参数满足系统要求。

如需更详细的电气特性曲线、封装尺寸或应用参考电路,可联系供应商索取完整数据手册。

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