WMSIC Electronic Components

BORN RCLAMP0582B-N

ModelRCLAMP0582B-N
PackageSOT-523(SC-75)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN RCLAMP0582B-N
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
RCLAMP0582B-N
Electronic Component
1
Package
SOT-523(SC-75)
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.027g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.7pF
Electronic Component
BM0264222534
Voltage
17V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RCLAMP0582B-N 产品概述

一、产品简介

RCLAMP0582B-N 是 BORN(伯恩半导体)出品的一款双路单向瞬态抑制(ESD)二极管,采用固态硅雪崩工艺制造,专为数据线和自助终端等对抗静电放电与浪涌脉冲的应用场景设计。器件具有极低结电容(Cj = 0.7 pF,典型值)、低漏电流和低钳位电压,配合 SOT-523(SC-75)超小封装,便于在空间受限的移动设备、通信接口与金融设备中使用。

二、主要特性

  • 极性:单向(Unidirectional)
  • 通道数:双路(Dual)
  • 反向工作电压 Vrwm:5 V
  • 击穿电压 VBR:7 V(典型)
  • 钳位电压(典型):17 V(在 8/20 μs 浪涌条件下)
  • 峰值脉冲电流 Ipp:3.5 A @ 8/20 μs
  • 峰值脉冲功率 Ppp:45 W @ 8/20 μs
  • 反向漏电流 Ir:1 μA(典型)
  • 结电容 Cj:0.7 pF(典型)
  • 防护等级:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)测试要求
  • 封装:SOT-523(SC-75),超小型表面贴装

三、优势与应用价值

  • 低电容:Cj = 0.7 pF 的低结电容使器件对高速数据线干扰极小,适合差分信号对和高频接口的瞬态保护,不影响信号完整性。
  • 低钳位电压:在遭受静电或浪涌时能将线电压快速钳制至较低水平,保护后端敏感芯片免受过压损害。
  • 低漏电流:Ir 仅 1 μA,有利于电池供电或高阻电路的长期稳定性。
  • 小体积双路集成:SOT-523 小封装内集成双路保护,节省 PCB 布局空间,简化设计与装配成本。
  • 工业级抗扰能力:满足常见 IEC 测试标准,适合金融终端(如 ATM)、通信和消费类电子的可靠性需求。

四、典型应用场景

  • 高速数据线差分对(USB、SATA、LVDS 等)保护
  • 网络接口与通信模块的输入保护
  • 自动取款机(ATM)、售卖机等自助设备的前端保护
  • 移动终端、平板、路由器等空间受限设备的 ESD/浪涌保护
  • 任何需要低电容、高可靠性瞬态保护的信号线路

五、典型接线示意

在差分信号或双信号线的常规用法中,RCLAMP0582B-N 的两路通常分别连接于每一信号线与参考地(或系统地)之间,器件应靠近外部接口(如连接器)放置,尽量缩短引线长度以最大化防护效果。建议在布局时为接地处保留单一低阻回流路径(短且宽的地铜)和必要的去耦设计,以降低钳位时的地电位上升。

六、封装与可靠性

  • 封装形式:SOT-523(SC-75),适合自动贴片加工与回流焊接。
  • 环境与可靠性:器件在设计上满足 IEC 61000-4-2/4-4/4-5 的抗扰测试要求,适配常见工业与商用电磁干扰环境。
  • 存储与处理建议:避免潮湿与剧烈温度变化,贴片前参照标准的焊接与存储规范(如 JEDEC/IPC 推荐的回流与干燥处理流程)。

七、设计与使用建议

  • 放置位置:将器件尽量靠近需要保护的连接器或输入端口,以缩短 PCB 走线并降低串联阻抗。
  • 地线处理:保证器件到地的回流路径尽可能短且宽,以降低钳位时的地电位漂移。
  • 与滤波电路配合:对于要求更高的差模/共模滤波,可与小型电感或共模滤波器配合使用,但需关注整体电容与信号完整性。
  • 温度与功率:峰值参数(Ipp、Ppp)基于 8/20 μs 波形测试,应避免在重复高能脉冲下长期超额使用;在实际设计中建议留有安全裕量。

八、订购信息

  • 型号:RCLAMP0582B-N
  • 品牌:BORN(伯恩半导体)
  • 封装:SOT-523(SC-75)
  • 备注:在采购与批量设计前建议向供应商索取完整数据手册和样品以完成电性能评估与兼容性验证。

如果需要,我可以基于您的具体接口类型(例如 USB、Ethernet 或某一差分接口)给出参考原理图和 PCB 布局注意事项。

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