WMSIC Electronic Components

BORN SMFJ7.0CA

ModelSMFJ7.0CA
PackageSOD-123F
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMFJ7.0CA
Type
BORN
Minimum package
3000

Technical parameters

Electronic Component
BORN
Electronic Component
SMFJ7.0CA
Electronic Component
1
Package
SOD-123F
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.043g
Electronic Component
1
Electronic Component
BM0257666464
Voltage
12V
Current(Ir)
100uA
Voltage(VBR)
7.78V
Electronic Component
3000
Power(Ppp)
200W@10/1000us
Current(Ipp)
16.7A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMFJ7.0CA 产品概述

一、产品简介

SMFJ7.0CA 是 BORN(伯恩半导体)推出的一款表面贴装型瞬态电压抑制器(TVS),封装为 SOD-123F,属于双向保护器件,可对静电放电(ESD)和浪涌过电压提供快速钳位保护。典型用于电源线、信号线、通信接口等需要瞬态过压抑制的场合。

二、主要特点

  • 极性:双向(适合双向浪涌/交流或差分信号保护)
  • 反向截止电压 Vrwm:7 V(稳态耐压)
  • 钳位电压 Vc(典型):12 V(在规定脉冲下钳位)
  • 峰值脉冲电流 Ipp:16.7 A
  • 峰值脉冲功率 Ppp:200 W(按 10/1000 μs 波形)
  • 击穿电压 Vbr:7.78 V(典型)
  • 反向漏电流 Ir:100 μA(在 Vrwm 条件下)
  • 封装:SOD-123F,适合自动贴片生产

三、电气性能要点

SMFJ7.0CA 在 10/1000 μs 的脉冲条件下可吸收 200 W 的冲击能量,峰值脉冲电流为 16.7 A,钳位电压约 12 V(钳位值随测试波形和环境温度略有变化)。击穿电压约 7.78 V,反向漏电流在额定 Vrwm(7 V)附近约为 100 μA,适合对较低电压等级电路提供有效保护,同时保持较小的静态功耗。

四、典型应用

  • 低压电源线保护(如 5–12 V 系统)
  • 串行通信接口(RS-485、CAN)、以太网物理层前端保护
  • 工业控制、仪器仪表、车载电子的瞬态浪涌防护(注意符合系统浪涌能力要求)
  • 手机配件、消费类电子的接口和外部连接器防护

五、封装与安装建议

SOD-123F 封装便于 SMT 工艺,建议将器件尽可能靠近被保护的接口或器件引脚焊接,缩短引线长度以提升保护效果。焊接时遵循回流焊温度曲线,避免长时间过高温度。PCB 走线应考虑散热与浪涌能量扩散,必要时增大铜箔面积以提升脉冲承载能力。

六、选型与注意事项

  • 确认系统最大工作电压和 Vrwm(7 V)匹配,避免常态下触发钳位。
  • 根据可能出现的冲击能量(波形与幅值)对比 Ppp=200 W(10/1000 μs)和 Ipp=16.7 A 是否足够。
  • 双向器件适用于交流或双向瞬变,若只需单向保护请选单向型 TVS。
  • 对于更高可靠性需求,关注工作温度、焊接工艺和长期漏电要求;在关键应用中做实际浪涌试验验证。

如需原理图接法、推荐封装尺寸图或在特定应用(如车规环境、通讯端口)下的设计建议,可提供更详细的参考资料与布局范例。

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