Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN SMAJ33CA
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMAJ33CA
- Type
- BORN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMAJ33CA
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.109g
- Electronic Component
- 1
- Electronic Component
- BM0220683880
- Voltage
- 53.3V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 36.7V
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMAJ33CA 产品概述
一、基本信息
- 品牌: BORN（伯恩半导体）
- 封装类型: DO-214AC
- 产品名称: SMAJ33CA
二、产品简介
SMAJ33CA是一款高性能的瞬态电压抑制二极管（TVS二极管），主要用于保护敏感电子设备免受电压尖峰和瞬态过电压的损害。其设计目标是为各种应用场合提供可靠的电压钳制保护，广泛用于通信、计算机、工业控制和消费电子等领域。
三、产品特性
高反向击穿电压: SMAJ33CA的反向击穿电压为33V，能够在过电压情况下有效限制电压水平。它能保护下游电路免受高电压冲击，尤其适合在AC和DC电源线上的使用。
快速响应时间: 该产品具备非常快的响应时间，能够在瞬态电压发生时迅速进行钳制反应，从而为敏感器件提供即时保护。
高功率处理能力: SMAJ33CA设计用于处理高达600W的尖峰功率，使其可以应对各种瞬态条件（如ESD、雷击等）而不损坏。
宽温度范围: 本产品的工作温度范围为-55°C至+150°C，能够在极端环境中稳定工作，保证其长期可靠性。
低泄漏电流: SMAJ33CA的泄漏电流特别低，适合用于低功耗和电池供电设备，避免无谓的能量损失。
环境友好: 该产品符合RoHS标准，不含有害物质，符合现代环境保护的要求。
四、应用领域
SMAJ33CA广泛应用于以下几个领域：
通信设备: 在网络设备、移动基站及光纤通信等领域中，保护电路免受瞬态干扰。
消费电子: 用于手机、平板电脑和其他便携式电子产品中，以防止静电放电（ESD）对重要组件的损害。
工业自动化: 在工控设备和PLC系统中，SMAJ33CA有助于稳定控制信号，保证设备的正常运行。
汽车电子: 随着汽车电子设备日益增加，SMAJ33CA也越来越多地应用于汽车的各种电子控制系统中，防止电压波动对电子控制单元（ECU）的干扰。
电源管理系统: 在直流电源和交流电源设备中，SMAJ33CA可作为保护元件，确保电源系统的安全稳定运行。
五、封装与安装
SMAJ33CA采用DO-214AC封装，具有较小的体积和良好的热性能。这种封装形式使产品容易与其他电子元器件集成，适合大规模的自动化生产。建议在安装时遵循相关的PCB设计指南，以确保最佳的电气性能和热管理。
六、总结
总的来说，SMAJ33CA是一款具有优异性能的TVS二极管，能够有效保护电子元器件免受瞬态电压影响。无论是在消费电子、汽车电子还是工业控制等广泛应用中，SMAJ33CA都展现出了可靠性和高效性，是电子设计师防护方案中的理想选择。选择BORN（伯恩半导体）的SMAJ33CA，您将可以确保您的应用在复杂电磁环境中的稳定性与安全性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
