WMSIC Electronic Components

BORN SMD1206-100/30N

ModelSMD1206-100/30N
Package1206
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD1206-100 / 30N
Type
BORN
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD1206-100/30N
Electronic Component
1
Electronic Component
1.8mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.046g
Electronic Component
3.4mm
Electronic Component
1.3mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0263572189
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206-100/30N 产品概述

一、产品简介

SMD1206-100/30N 为 BORN(伯恩半导体)出品的1206封装可恢复型聚合物自复位保险丝(PTC)。该器件额定耐压30V,保持电流1A,跳闸电流2A,适用于对过流保护、短路保护、重复使用性和空间受限的表贴电路。

二、主要参数

  • 封装:1206(3.4mm × 1.8mm × 1.3mm)
  • 品牌:BORN(伯恩半导体)
  • 耐压(Vmax):30V
  • 最大浪涌电流(Imax):40A
  • 保持电流(Ihold):1A
  • 跳闸电流(Itrip):2A
  • 动作时间:100ms(典型,触发条件下)
  • 功耗(Pd):800mW
  • 初始态阻值(Rmin):40mΩ
  • 跳断后阻值(R1max):270mΩ
  • 工作温度:-40℃ ~ +85℃

三、产品特性与优势

  • 小型表贴封装,适合高密度PCB设计;
  • 可恢复性:过流解除后自动复位,减少人工更换成本;
  • 快速响应(约100ms)以保护下游元件;
  • 支持高浪涌电流(40A)以承受瞬间短路或冲击;
  • 低初始阻值,有利于降低正常工作时的功耗与发热。

四、典型应用

  • 手机配件、便携式设备电源线路;
  • USB、充电器、车载电子及电源管理模块;
  • 工控及家用电器的辅助保护电路;
  • 电池管理与保护系统(作为二级保护件)。

五、选型与使用建议

  • 选择时以工作电流略高于实际工作电流但低于跳闸电流的型号为宜,确保正常工作不触发保护;
  • 注意环境温度对保持电流的影响,高温条件下保持电流会下降,应适度降额;
  • 对于长期连续负载或高温环境,考虑更高功耗余量或增加散热设计。

六、焊接与存储建议

  • 建议采用标准回流焊工艺,遵循元件厂商推荐的温度曲线;
  • 储存时避免长期潮湿、高温环境,贴片元件抗静电能力一般无需特别防护,但仍建议常规防护措施;
  • 生产测试时避免长时间通过高电流,以免误触发并影响参数判定。

小结:SMD1206-100/30N 以其小体积、可恢复保护与较高浪涌承受能力,非常适合空间受限且需重复过流保护的中低压电子设备。选择与布局时应注意热管理与环境温度的降额影响。

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