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BORN DSS36
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN DSS36
- Type
- BORN
- Minimum package
- 3000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- DSS36
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0231019427
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 100uA@60V
- (Vf)
- 850mV@3A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSS36 产品概述
一、产品简介
DSS36 是 BORN（伯恩半导体）推出的一款高可靠性整流二极管，封装为 SOD-123FL。该器件面向中小功率整流与保护场景，具备稳健的电气特性和宽工作温度范围，适合空间受限的表面贴装设计。
二、主要参数
- 正向压降 (Vf)：850 mV @ 3.0 A
- 直流反向耐压 (Vr)：60 V
- 连续整流电流：3 A
- 反向电流 (Ir)：100 μA @ 60 V
- 工作结温范围：-55 ℃ ~ +125 ℃
- 非重复峰值浪涌电流 (Ifsm)：65 A
- 品牌：BORN（伯恩半导体）
- 封装：SOD-123FL
三、主要特性与优势
- 低功耗损失：在 3 A 工作点正向压降 0.85 V，可在中等电流下保持较低热耗，降低整体系统发热。
- 良好抗冲击能力：65 A 的非重复峰值浪涌电流，能够承受启动或短时过载时的冲击。
- 低漏电流：在 60 V 时反向电流仅 100 μA，适合需要低静态泄漏的电源和保护电路。
- 宽温度适应性：-55 ℃ 到 +125 ℃ 的工作结温范围，适合工业级和宽温环境应用。
- 紧凑封装：SOD-123FL 表面贴装设计，便于高密度 PCB 布局与自动化生产。
四、封装与热管理建议
SOD-123FL 封装节省 PCB 面积，但在接近 3 A 连续工作时需重视散热：
- 建议在器件焊盘处增加铜箔面积与散热过孔，改善传导散热。
- 对于长期高负载场景，应采用宽导线和充足的铜层以降低温升。
- 布局时保持热源和敏感元件之间适当间距，避免局部过热影响可靠性。
五、典型应用场景
- 开关电源次级整流与续流。
- DC-DC 转换器输出整流。
- 逆接保护与电源路径选择。
- 电池充放电保护与便携设备电源管理。
- 工业控制与通讯设备中的整流与保护电路（最大工作电压 ≤ 60 V）。
六、使用注意事项
- 不要超过额定直流电流和峰值浪涌电流，避免长期过载。
- 在高温环境下应考虑适当降额使用，确保结温不超过 +125 ℃。
- 正确识别极性并按推荐焊接工艺进行回流焊，避免因过热或焊接缺陷导致性能退化。
- 对于关键应用建议做实际条件下的热仿真与长时间应力测试以验证可靠性。
总结：DSS36 以其 3 A 连续整流能力、65 A 峰值浪涌承受力、60 V 的耐压和 SOD-123FL 紧凑封装，为中小功率电源与保护电路提供了可靠且易于集成的整流解决方案。在设计时结合合理的散热和布板措施，可在多种工业与消费类场景中发挥稳定作用。
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