WMSIC Electronic Components

BORN SMCJ60CA

ModelSMCJ60CA
PackageSMC
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMCJ60CA
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMCJ60CA
Electronic Component
1
Package
SMC
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.351g
Electronic Component
1
Electronic Component
BM0264222530
Operating Temperature
55℃~+150℃
Voltage
96.8V
Current(Ir)
1uA
Voltage(VBR)
66.7V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMCJ60CA 产品概述

一、产品简介

SMCJ60CA 是伯恩半导体(BORN)推出的一款双向功率瞬态电压抑制器(TVS),采用 DO-214AB(SMC)封装。器件设计用于保护电源线和信号线免受瞬态过压冲击,能在工业、通信、电源和汽车等领域对浪涌和电弧瞬变提供可靠抑制。标称反向工作电压(VRWM)为 60V,适合 48V 及类似电压等级的系统保护。

二、主要参数

  • 类型:双向 TVS(双极性吸收瞬变能量)
  • 封装:DO-214AB(SMC)
  • 反向阻断电压(VRWM):60 V
  • 击穿电压(VBR):66.7 V
  • 峰值钳位电压:96.8 V
  • 峰值脉冲电流(Ipp,10/1000µs):15.5 A
  • 峰值脉冲功率(Ppp,10/1000µs):1500 W(1.5 kW)
  • 反向静态电流(IR):1 µA(典型/最大)
  • 工作温度范围:-55 ℃ 至 +150 ℃
  • 品牌:BORN(伯恩半导体)

三、特点与优势

  • 高能量吸收:10/1000µs 波形下 1500W 峰值功率,能有效消化中等能量浪涌。
  • 低钳位电压:96.8V 的钳位水平可将瞬态峰值限制在设备可承受范围,降低后级元件损坏风险。
  • 低漏电流:1µA 级别的反向电流有利于高阻抗系统和待机功耗敏感应用。
  • 宽温度范围:-55℃ 至 +150℃,适应苛刻环境与长期可靠性要求。
  • 双向结构:适合交流/双向脉冲场合或需在正负方向同时抑制浪涌的电路。

四、典型应用

  • 48V 通信与基站电源保护
  • 工业电源总线与分配网络的浪涌防护
  • 直流电源输入保护(如太阳能、储能系统)
  • 电机驱动、电源转换器和楼宇自动化系统的瞬态抑制
  • 串行总线与信号线的双向过压防护(需注意功率和夹位水平匹配)

五、选型与使用建议

  • 若系统正常工作电压接近 48V,VRWM=60V 属合理选择;设计时应留足工作电压余量,避免在长期偏高电压下器件频繁进入击穿区。
  • 考虑到 Ppp 为 1500W(10/1000µs),在更高能量或重复冲击环境下建议并联或选择更高能量等级的保护器件。
  • 布局时应尽量缩短 TVS 与被保护节点之间的走线,保证低阻抗的流向路径,提高抑制效率并减小寄生感抗。
  • 热管理:SMC 封装具有较好散热,但在持续或高频冲击场合需注意 PCB 铜箔散热与焊盘设计,必要时增加散热面积。

六、封装与订购信息

  • 封装形式:SMC(DO-214AB),表面贴装,便于自动化贴装与回流焊工艺。
  • 推荐在图纸和物料清单中注明完整型号 SMCJ60CA(BORN/伯恩半导体)及技术要求,订购前确认储运与可靠性需求。

以上为 SMCJ60CA 的主要概述与应用建议。如需更详细的电气特性曲线、封装尺寸、浪涌能量等级试验波形或具体布局参考图,请告知以便提供更完善的资料。

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