Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN PESD3V3S1UB-N
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN PESD3V3S1UB-N
- Type
- BORN
- Minimum package
- 5000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- PESD3V3S1UB-N
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 160pF
- Electronic Component
- BM0257629531
- Voltage
- 12V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 1uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PESD3V3S1UB-N 产品概述
一、概述
PESD3V3S1UB-N 是伯恩（BORN）推出的一款单向 TVS 二极管，封装为 SOD-523（SC-79），专为 3.3V 系统线缆、接口和信号线的静电放电（ESD）与浪涌保护设计。器件在小体积下提供较高的峰值脉冲功率和可靠的抗干扰性能，适合集成于移动设备、消费电子、通信与工业控制终端的输入/输出保护电路。
二、主要电气参数
- 极性：单向
- 反向工作电压 (Vrwm)：3.3 V
- 击穿电压 (Vbr)：6 V（典型）
- 钳位电压：12 V（在指定脉冲条件下）
- 峰值脉冲电流 (Ipp)：15 A（8/20µs）
- 峰值脉冲功率 (Ppp)：100 W @ 8/20µs
- 反向电流 (Ir)：1 µA（在 Vrwm 下）
- 结电容 (Cj)：160 pF
- 通道数：单路
三、认证与适用标准
符合 IEC 61000-4-2（ESD）、IEC 61000-4-4（EFT）及 IEC 61000-4-5（浪涌）相关测试要求，能有效抑制短时高能瞬态，保护下游芯片免受损害。
四、优势与限制
优势：
- 小型 SOD-523 封装，便于高密度 PCB 布局与自动贴装。
- 在 8/20µs 测试条件下可承受 100 W 峰值功率，抗浪涌能力强。
限制： - 结电容较高（160 pF），对高频高速信号（如高速 USB/PCIe）可能影响信号完整性，应在设计时评估是否合适。
- 钳位电压较高（12 V），对对被保护端允许的瞬态电压需确认是否在可接受范围内。
五、典型应用
- 3.3V 电源轨和供电保护
- 接口保护：UART、GPIO、低速 USB、I2C（带注意电容影响）
- 移动设备、消费电子和通信终端的输入接口防护
- 工业控制模块的端口抗干扰设计
六、布局与使用建议
- 器件应尽量靠近被保护引脚焊盘放置，减小寄生感抗与回路面积。
- 将地线通过多短而粗的焊盘或过孔直接返回参考地，保证快速散流。
- 对于高速信号，若结电容影响信号，应评估替代低容型 TVS 或在前端增加阻抗匹配。
- 不要超出 8/20µs 能量规格进行连续浪涌承受，设计中可并联更高能量保护元件（如 TVS 阵列或气体放电管）实现分级防护。
- 采用推荐的回流焊工艺，按照数据手册的温度曲线进行焊接。
七、封装与订购信息
- 封装：SOD-523（体积小，适合自动贴装）
- 品牌：BORN（伯恩半导体）
- 型号：PESD3V3S1UB-N
下单时请确认规格（单向、Vrwm=3.3V、Cj、Ppp 等）以匹配设计需求。
如需更详细的典型特性曲线（I-V、钳位曲线、浪涌测试波形）、PCB 参考封装或可靠性数据（如稳态功耗与温度系数），建议参考厂商完整数据手册或咨询供应商技术支持。
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