WMSIC Electronic Components

BORN SMD0805-100/16N

ModelSMD0805-100/16N
Package0805
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD0805-100 / 16N
Type
BORN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD0805-100/16N
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.032g
Electronic Component
2.3mm
Electronic Component
1.15mm
Electronic Component
1
Electronic Component
300ms
Electronic Component
BM0264692227
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD0805-100/16N 产品概述

一、产品简介

SMD0805-100/16N 是 BORN(伯恩半导体)推出的一款 0805 封装可恢复保险丝(PTC 自恢复保险元件),耐压 16V,额定保持电流 1A,跳闸电流 2A。器件体积小(0805:长 2.3mm × 宽 1.5mm × 高 1.15mm),适合表面贴装,主要用于对过流、短路及异常负载情况下进行自恢复保护。

二、主要参数

  • 耐压(Vmax):16V
  • 最大电流(Imax,脉冲耐受):100A(短时冲击能力)
  • 保持电流(Ihold):1A(长期允许通过电流)
  • 跳闸电流(Itrip):2A(触发保护的典型电流)
  • 消耗功率(Pd):600mW(最大功耗)
  • 初始态阻值(Rmin):60mΩ(典型初始阻抗)
  • 动作时间:300ms(在规定过流条件下触发时间)
  • 工作温度:-40℃ ~ +85℃
  • 封装:0805(SMD)
    以上参数为典型及最大额定值,具体应用时请参照厂方完整规格书以获得详细曲线与条件。

三、特性与优势

  • 体积小、重量轻,适合空间受限的便携类与消费电子产品。
  • 自恢复特性:过流解除后元件可自动恢复导通,无需更换。
  • 高脉冲耐受能力(Imax 100A):能承受瞬态浪涌电流(仅限短时)。
  • 低初始阻值(60mΩ),在额定保持电流下电压降小,热损耗低(1A × 60mΩ ≈ 60mV,功耗约60mW,远低于最大 Pd)。
  • 宽温度工作范围,适应多数工业与消费环境。

四、典型应用场景

  • 手机、平板、移动电源等便携设备的 USB/电源保护。
  • 电路板级电源入口短路保护、测量与控制模块保护。
  • 电池保护、充电电路、接口防护(USB、HDMI 等)。
  • 家用电器、智能家居与物联网终端的过流保护。

五、设计与使用建议

  • 布局:尽量靠近被保护电源引入端或受保护器件,减少走线电阻与寄生热源影响。
  • 散热与环境:尽量避免将元件置于长期高温或热源旁,否则会影响动作特性与寿命。
  • 焊接:采用标准贴片回流工艺,遵循厂家建议的回流焊曲线,避免过长时间高温暴露。
  • 余量与选型:按电路最大工作电流选型时应考虑工作温度、环境与器件老化,必要时选择留有适当余量的型号或并联方案(并联需谨慎,需评估均流)。
  • 测试验证:在实际系统中进行过流/冲击测试与热升验证,确认动作电流与恢复行为满足系统安全要求。

如需完整电气特性曲线、热特性曲线或回流焊建议,请联系 BORN(伯恩)或索取该型号详细数据手册,以便在具体项目中完成最终设计验证。

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