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BORN ESDA25L
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN ESDA25L
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- ESDA25L
- Electronic Component
- 1
- Package
- SOT-23
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Cj- Capacitor
- 30pF
- Electronic Component
- BM0258759993
- Voltage
- 44V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 100nA
- Voltage(VBR)
- 26.7V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ESDA25L 产品概述
一、主要参数
ESDA25L（BORN/伯恩半导体，SOT-23封装）是一款用于瞬态过电压与静电放电保护的二极管类器件。关键参数如下：反向截止电压 Vrwm = 24V；击穿电压（Vbr）≈ 26.7V；钳位电压 Vclamp = 44V；峰值脉冲电流 Ipp = 6A；峰值脉冲功率 Ppp = 300W（8/20μs波形）；反向电流 Ir = 100nA；结电容 Cj = 30pF。器件满足 IEC 61000-4-2（ESD）、IEC 61000-4-4（EFT）与 IEC 61000-4-5（浪涌）等工业防护等级。
二、产品特性
- 高能量吸收能力：在8/20μs波形下可承受300W峰值脉冲功率，能有效钳制短时浪涌和雷击诱发的瞬态能量。
- 有限峰值电流能力：单次峰值脉冲电流可达6A，适用于常见信号线与低功率电源线的瞬态保护。
- 低漏电流：反向电流约100nA，适合对静态功耗敏感的电路。
- 中等结电容：Cj≈30pF，对高速数据信号存在一定负载，需在高速接口选型时评估影响。
- 小型封装：SOT-23方便表面贴装，利于空间受限的应用。
三、典型应用场景
- 数字接口保护：用于RS-232、RS-485、CAN等工业通信接口的过压和静电防护（对高速差分总线需评估电容影响）。
- 电源和控制线防护：24V及以下电源总线和控制信号线的浪涌与瞬态抑制。
- 工业设备与楼宇自控：配合其他滤波与抑制元件，提升设备对雷击、开关感应和静电冲击的抗扰度。
- 消费类与便携设备：用于接口和外部引脚防护，降低因插拔或静电导致的故障率。
四、选型与布线建议
- 确认工作点：Vrwm=24V，适用于直流工作电压不超过24V的线路。若系统存在更高持续电压，应选更高Vrwm器件。
- 考虑结电容：Cj=30pF对高频或高速差分信号（如USB3.0或高速以太网）可能引入串扰或信号失真，必要时采用低电容TVS或在接口侧添加有源隔离。
- PCB布局：将器件放置于靠近受保护端口的最短路径，尽量缩短走线并增大回流面，保证钳制瞬态时快速导流到接地。对敏感电路采用专用地平面并加接地过孔。
- 热/能量管理：Ppp为脉冲额定值，长时间或重复高能脉冲会损伤器件，必要时配合功率电阻、保险丝或更大功率的抑制器件。
五、认证与封装
ESDA25L通过主要的IEC抗扰度标准认证（IEC 61000-4-2/4-4/4-5），封装为SOT-23，适合集成在SMT工艺中，品牌为BORN（伯恩半导体），便于量产与替换。
六、总结
ESDA25L是一款面向24V等级电源与信号线的通用瞬态保护器件，具备较高的脉冲吸收能力、低漏电和小型封装。选型时需综合考虑工作电压、脉冲能量、结电容对信号完整性的影响以及PCB布局与热管理策略，以确保在实际应用中达到最佳防护效果。
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