WMSIC Electronic Components

BORN SMD0603-004/15N

ModelSMD0603-004/15N
Package0603
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD0603-004 / 15N
Type
BORN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD0603-004/15N
Electronic Component
1
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.043g
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0263578208
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
15V
Power(Pd)
500mW
Current(Imax)
20A
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD0603-004/15N 自恢复保险丝产品概述

SMD0603-004/15N是伯恩半导体(BORN)推出的一款0603封装高分子自恢复保险丝(PPTC),专为低压小电流电路的过流保护场景设计,兼具体积小、响应快、可重复使用等特点,广泛适配消费电子、车载低压附件、智能穿戴等领域的电路保护需求。

一、产品核心定位与应用场景

该器件属于过流保护类被动元器件,核心作用是在电路出现过载、短路等异常过流时,快速切断电流以保护后端敏感元器件,故障排除后自动恢复导通,无需人工更换。其典型应用场景包括:

  • 移动智能设备:手机电池保护板、蓝牙耳机/智能手环的充电接口及传感器电路;
  • 小型电子模块:USB转串口模块、无线充电器输出端口;
  • 车载低压附件:仪表盘背光电路、胎压监测传感器、车载USB充电口;
  • 消费电子配件:充电宝输出端、智能音箱的电源输入保护。

二、关键电气性能参数解析

SMD0603-004/15N的参数设计精准匹配低压小电流电路的保护需求,核心参数及意义如下:

  1. 耐压(Vmax=15V):器件两端可承受的最大直流/交流电压,适配5V、12V等低压系统,不建议用于高压电路;
  2. 最大电流(Imax=20A):正常工作状态下可持续通过的最大电流,需结合电路实际功耗选择,避免长期超载;
  3. 保持电流(Ihold=40mA):室温(25℃)下器件保持导通的最大电流,若电路正常工作电流≤40mA,可稳定运行;
  4. 跳闸电流(Itrip=120mA):室温下超过此电流时,器件会在1s内触发保护(阻值骤升),切断过流路径;
  5. 消耗功率(Pd=500mW):正常导通时的功率损耗,低功耗设计不影响电路整体效率;
  6. 初始态阻值(Rmin=4mΩ):常态下的串联电阻极小,对信号传输、功率损耗影响可忽略;
  7. 跳断后阻值(R1max=40mΩ):跳闸后保持的电阻值(仍属低阻),故障排除后温度下降会自动恢复至初始低阻;
  8. 动作时间(1s):过流触发到跳闸的响应时间,兼顾快速保护与避免瞬态电流(如电容充电)误触发;
  9. 工作温度(-40℃~+85℃):宽温范围覆盖工业、车载等严苛环境,低温下性能稳定,高温下仍保持有效保护。

三、封装与可靠性设计特点

  1. 0603小型化封装:尺寸仅1.6mm×0.8mm,适配高密度PCB设计,满足小型化电子设备的布局需求;
  2. 高分子材料稳定性:采用伯恩自研PPTC材料,多次跳闸恢复后性能一致性良好,无明显老化衰减;
  3. 焊接可靠性:贴片封装适配回流焊、波峰焊工艺,焊接后抗冲击振动能力强,符合车载级可靠性要求;
  4. 环保合规:符合RoHS、REACH等环保标准,无铅无卤,适配绿色电子产品设计。

四、选型与使用注意事项

为确保保护效果与器件寿命,需注意以下要点:

  1. 选型匹配:电路正常工作电流需≤Ihold(40mA),瞬态峰值电流需≤Itrip(120mA),避免误触发或保护失效;
  2. 焊接规范:回流焊峰值温度≤260℃,焊接时间≤10s;波峰焊温度≤250℃,时间≤5s,避免高温损坏器件;
  3. 安装位置:尽量靠近被保护电路的输入端,减少布线电阻对过流检测的干扰;
  4. 故障处理:跳闸后需先排查短路、过载等故障源,待器件冷却至室温(约30分钟)后自动恢复导通,无需更换;
  5. 环境限制:避免长期处于85℃以上环境,否则会降低保持电流与跳闸电流,影响保护性能。

该器件凭借精准的参数设计、小型化封装与可靠的保护性能,成为低压小电流电路过流保护的优选方案,适配多领域电子设备的轻量化、智能化需求。

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