Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN BDFN2C051L
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BDFN2C051L
- Type
- BORN
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BDFN2C051L
- Electronic Component
- 1
- Package
- DFN1006-2L
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 1.5pF
- Electronic Component
- BM0219850735
- Voltage
- 11V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-2
- Current(Ir)
- 500nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BDFN2C051L 产品概述
一、基本信息
BDFN2C051L 是由 BORN (伯恩半导体) 设计制造的一款高性能电子元器件，采用 DFN-2L 封装形式。这种设计使其在小型化和高性能需求的电子设备中具有广泛的应用。作为一种新型半导体产品，BDFN2C051L 采用现代制造工艺，旨在满足多种电气和热性能要求。
二、封装介绍
DFN-2L 封装是一个紧凑的表面贴装封装，具有良好的热传导性能和电气性能。其双引脚结构允许快速、有效的焊接，适合自动化生产。此外，DFN 封装的低剖面设计减少了空间占用，符合紧凑型电子设备日益增长的需求。
三、主要特点
小尺寸与高集成度：BDFN2C051L 通过高集成度设计，使得其在有限的空间内实现更多功能，适合智能手机、可穿戴设备、物联网设备等需要小型化的应用。
优异的热性能：得益于采用 DFN 封装，BDFN2C051L 展示出优异的热散逸能力，可以在高功率条件下稳定工作，保证器件和整个系统的可靠性。
可靠性：BORN 半导体以其高 yields 和严格的测试流程，确保 BDFN2C051L 在各种应用场景下都能保持高可靠性，特别适合对稳定性和耐用性有高要求的工业和消费类电子。
电气特性：产品具有宽广的工作电压范围，优异的电流驱动能力，以及快速的响应时间，能够应对快速变化的输入信号，满足现代电路设计中的高效性要求。
四、应用领域
BDFN2C051L 的设计使其特别适合多种应用领域，包括但不限于：
消费电子：如智能手机、平板电脑、便携式音响设备等，帮助实现更好的性能与续航。
工业设备：在自动化设备、传感器和控制系统中，提供可靠的电源管理与信号处理能力。
物联网(IoT)：在物联网设备中，是实现低功耗和高效率的核心组成部分，助力更广泛的网络连接。
汽车电子：在汽车电子系统中，作为信号转换器和电源管理单元，提供稳定和安全的性能，确保车辆安全。
医疗设备：在高精度医疗仪器中，提供可靠的电气支持与稳定性，保障生命健康监测的正确性和连续性。
五、总结
综上所述，BDFN2C051L 是一款性能卓越、可靠性高的半导体元器件，适合多种现代电子应用。随着电子设备的小型化和多功能化趋势日益加强，BDFN2C051L 作为一种高集成度、低功耗、高响应的电子元器件，相信将在未来的电子市场中发挥越来越重要的作用。BORN 半导体凭借其优质的产品和服务，势必为客户创造更大的价值，并推动科技的持续进步与创新。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
