WMSIC Electronic Components

BORN SMFJ7.5CA

ModelSMFJ7.5CA
PackageSOD-123FL
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMFJ7.5CA
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMFJ7.5CA
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.043g
Electronic Component
1
Electronic Component
BM0230241895
Operating Temperature
55℃~+150℃
Voltage
12.9V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
50uA
Voltage(VBR)
8.33V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMFJ7.5CA 瞬态抑制二极管(TVS)产品概述

一、产品简介

SMFJ7.5CA 为 BORN(伯恩半导体)推出的双向瞬态电压抑制二极管(TVS),采用 SOD-123FL 表面贴装封装,专为对电源线、信号线及桥接/差分线路的瞬态过压保护设计。器件能够在极短时间内吸收来自雷击、静电放电(ESD)、电快速瞬变(EFT) 等瞬态能量,保护下游敏感器件和电路正常工作。

二、主要电气参数

  • 标称反向工作电压(Vrwm):7.5 V
  • 击穿电压(Vbr):约 8.33 V
  • 钳位电压(Vclamp):12.9 V
  • 峰值脉冲功率(Ppp):200 W(10/1000 μs 波形)
  • 峰值脉冲电流(Ipp):15.5 A
  • 反向漏电流(Ir):≤ 50 μA
  • 极性:双向(适用于交流/双向信号线路)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 防护等级:符合 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)标准
  • 类型:瞬态抑制二极管(TVS)
  • 封装:SOD-123FL(低高度、可回流贴装)

三、主要特性与优势

  • 高能量吸收能力:在标准 10/1000 μs 脉冲下可承受 200 W 的峰值功率,适合对抗较长持续时间的浪涌脉冲。
  • 有效钳位:12.9 V 的钳位电压可在发生瞬态时限制电压幅值,减少对后端器件的伤害。
  • 双向保护:可用于双向或交流信号线路,无需额外极性判断,适合差分信号及双向电源保护。
  • 宽温度范围:-55 ℃ 到 +150 ℃ 的工作温域,满足一般工业级环境要求。
  • 小型低剖面封装:SOD-123FL 适合高密度 PCB 布局,便于自动贴装与回流焊接。
  • 标准兼容性:通过 IEC 61000-4-2/4-4 等抗扰度标准认证,有利于系统级 EMC 设计。

四、典型应用场景

  • 工业设备及控制系统的电源与信号接口保护(如传感器、PLC 接口等);
  • 通信接口保护(如 RS-485、CAN 总线 等差分/双向总线);
  • 消费电子和嵌入式系统中 5 V/± 对称供电或双向信号线路的浪涌保护;
  • 医疗仪器、测试测量设备等需要抗干扰能力的外部输入保护端口;
  • 需要满足 IEC ESD/EFT 抗扰度的系统级电磁兼容设计。

五、封装与可靠性注意事项

  • SOD-123FL 为薄型贴片封装,推荐按厂商给出的回流焊温度曲线和 PCB 焊盘尺寸进行布局与焊接,以确保焊接可靠性与热扩散性。
  • 由于反向漏电流会随温度上升而增大,设计时应考虑最高工作温度下的漏流对系统功耗或待机电流的影响。
  • 峰值脉冲能力为瞬态限幅设计参数,重复冲击或高能量脉冲可能需要额外降额或并联/级联设计;对重复脉冲场景建议参考厂商的能量处理/热损耗曲线并适当降额使用。
  • 器件为双向结构,若用于单向电源轨(例如需正向钳位),应选用相应单向 TVS 器件以获得更低的钳位电压与更优保护效果。

六、选型与工程建议

  • 若目标保护电压接近 7.5 V(如 5 V 系统的过压容忍范围),SMFJ7.5CA 可作为合理选择;如需更低钳位以保护对电压敏感的器件,可考虑更低 Vcl 或单向型号。
  • 在高频/高速信号线上使用时,注意 TVS 的电容特性可能影响信号完整性,必要时评估等效电容并选择低电容 TVS 方案。
  • 在具有高能量浪涌(如直接雷击或长电缆引入的大能量脉冲)应用中,建议与熔断器、金属氧化物压敏电阻(MOV)或多级保护网络组合使用,以分担能量并提升系统可靠性。
  • 设计 PCB 时将 TVS 靠近被保护端口放置,并保证良好的接地回路与铜箔散热以提高吸收与散热能力。

SMFJ7.5CA 以其稳定的电气参数、双向保护特性及小型封装,适合用于要求抗 ESD/EFT 且需中等能量浪涌抑制的场合。具体电气特性与封装尺寸请以厂方数据手册(Datasheet)为准,进行最终工程验证与热可靠性评估。

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