WMSIC Electronic Components

BORN 1.5SMBJ24CA

Model1.5SMBJ24CA
PackageSMB(DO-214AA)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN 1.5SMBJ24CA
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
1.5SMBJ24CA
Electronic Component
1
Package
SMB(DO-214AA)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.24g
Electronic Component
1
Electronic Component
BM0264682164
Voltage
38.9V
Current(Ir)
1uA
Voltage(VBR)
26.7V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1.5SMBJ24CA 产品概述

一、产品简介

1.5SMBJ24CA 是 BORN(伯恩半导体)推出的一款双向瞬态抑制二极管(TVS),封装为 SMB(DO-214AA)。器件针对瞬态浪涌(雷击、电源切换、静电放电等)提供快速钳位保护,适用于电信、计算机及工业电子设备的电源和信号线防护。采用玻璃钝化芯片与环氧树脂封装,兼顾可靠性与成本。

二、主要电气参数

  • 极性:双向(Bi-directional),可对正负极性瞬变进行对称钳位。
  • 反向截止电压 Vrwm:24 V(稳态工作电压)。
  • 击穿电压 VBR:26.7 V(在厂家规定测试电流下的典型值)。
  • 钳位电压 Vc:38.9 V(在峰值脉冲电流条件下的典型钳位电压)。
  • 峰值脉冲电流 Ipp:15.5 A(对应厂家测试波形下的瞬态电流能力)。
  • 峰值脉冲功率 Ppp:1.5 kW(器件在标准测试波形条件下的吸收能量能力)。
  • 反向漏电流 Ir:1 μA(在 Vrwm 条件下的典型漏电)。
  • 类型:TVS(瞬态抑制二极管)。

以上参数为典型/名义值,设计时应参考厂方完整 Datasheet 中的测试条件(波形、持续时间、环境温度等)。

三、关键特性

  • 优秀钳位能力:在大电流冲击下能将瞬态电压有效钳制在安全范围内,保护后级器件免受过压损害。
  • 低漏电流:1 μA 的低漏电特性有利于降低系统待机功耗,适合要求低静态电流的应用。
  • 低电容:适合用于对信号完整性有要求的接口保护(如通信总线),减少对高速信号的影响。
  • 高浪涌能力:1.5 kW 的峰值脉冲功率和 15.5 A 峰值脉冲电流保证对短时大能量瞬态的吸收。
  • 制程与封装:玻璃钝化芯片提高了电气稳定性与长期可靠性;SMB 封装便于自动贴装、热耗散合理。

四、典型应用场景

  • 电信设备:基站、交换机、路由器等电源与接口保护。
  • 计算机与外设:主板电源轨、接口电路(特别是需双向保护的差分或可逆电压线路)。
  • 工业控制:传感器供电线、继电器驱动电路及现场总线防护。
  • 通用浪涌保护模块:与熔断器、压敏电阻等配合构成多级防护。

五、设计与布局建议

  • 放置位置:尽量靠近被保护的插座或接口,减小走线电感与寄生阻抗。
  • 焊盘与热管理:按照封装推荐尺寸设计焊盘,必要时在焊盘下或附近增加过孔以利于散热。
  • 串联元件:在需要时与熔断器、限流电阻配合使用,提高系统在大能量冲击下的生存能力。
  • 信号完整性:利用其低电容特性保护高频/差分信号,但若对超高速有更严格要求,需检查器件在工作条件下的具体电容值。

六、可靠性与合规

玻璃钝化芯片与环氧封装赋予器件良好的热稳定性与长期可靠性。适配工业级工作环境时,请参考厂家温度范围与冲击、振动等测试报告。若用于关键通信设备,应关注相关电气安全与电磁兼容(EMC)规范的整体系统级验证。

七、选型与注意事项

  • 双向特性适合可正负反转或交流类瞬变;若仅需对单向电压过冲保护,可考虑单向 TVS 以获得更低的钳位电压。
  • 验证厂家 Datasheet 中的测试波形(如 8/20 μs 或 10/1000 μs)与实际工况是否一致,避免在不同波形下误判保护能力。
  • 留意温度对漏电流、钳位电压和寿命的影响,设计中预留裕量。

总结:1.5SMBJ24CA 在 SMB 封装中提供了 24 V 工作电压等级下可靠的双向浪涌保护,具有低漏电、低电容和较高的脉冲吸收能力,适合电信、计算机及工业电子领域的电源与信号线保护。选型时请结合完整 Datasheet 与系统工况进行验证。

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