WMSIC Electronic Components

BORN BSD3A031V

ModelBSD3A031V
PackageSOD-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BSD3A031V
Type
BORN
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BSD3A031V
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.028g
Electronic Component
1
Cj- Capacitor
100pF
Electronic Component
BM0258885491
Voltage
15V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
4V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSD3A031V 产品概述

一、产品简介

BSD3A031V 是 BORN(伯恩半导体)推出的一款单向瞬态抑制二极管(TVS),用于对 3.3V 工作电源或 I/O 接口提供浪涌、静电放电(ESD)和电快速瞬变(EFT)保护。器件采用 SOD-323 小体积封装,适合空间受限的表贴设计。

二、主要电气参数

  • 极性:单向(单向钳位正向瞬态到地)
  • 额定反向工作电压 Vrwm:3.3V
  • 击穿电压 Vbr:约 4V
  • 钳位电压 Vc(峰值脉冲时):15V(产品典型钳位能力)
  • 峰值脉冲电流 Ipp:16A(8/20µs 波形)
  • 峰值脉冲功率 Ppp:240W(8/20µs 波形)
  • 反向静态电流 Ir:1µA(在 Vrwm 条件下)
  • 结电容 Cj:100pF(对高速信号有一定影响)
  • 防护等级/标准:符合 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)

以上参数表明该器件在规定脉冲波形下能提供可靠的能量吸收与钳位能力,但不适合作为连续电源元件使用。

三、典型应用场景

  • 3.3V 电源线路保护(板对地瞬态抑制)
  • MCU、PHY、传感器等接口保护(在允许的电容范围内)
  • 通信接口及外部连接器保护(USB 2.0 较低速信号除外需评估电容影响)
  • 工业控制、消费类电子、物联网终端的浪涌与静电防护

四、封装与布局建议

SOD-323 小型封装利于节省 PCB 面积。为保证最佳保护效果,器件应尽量靠近被保护端口或连接器布局,钳位路径短而粗。单向 TVS 的阴极接被保护线,阳极接地(或系统公共地)。对高速信号使用前应评估 100pF 结电容对信号完整性的影响,必要时选择低电容替代品或采取隔离措施。

五、使用与可靠性要点

  • 峰值 Ipp 与 Ppp 基于 8/20µs 波形,表示瞬态能量吸收能力,非连续功率规格。
  • 反向静态电流较小(1µA),适合低功耗系统,但在高温或长时间偏置下应校验热耗散。
  • 满足 IEC 61000 系列抗扰度可用于多数工业与消费场景的瞬态防护要求。
  • 推荐在 PCB 设计中配合适当的过流保护(熔断、限流器)及滤波元件以提升整体稳健性。

六、选型与采购建议

在确定 BSD3A031V 是否适合系统时,请根据被保护节点的最大允许钳位电压、信号速率对应的容性负载容忍度以及预期脉冲能量进行验证。SOD-323 的可焊接性与回流工艺兼容性良好,适合量产表贴工艺。购买时可参照 BORN(伯恩半导体)官方型号与封装标识,确保器件真伪与批次一致性。

如需针对具体应用做更详细的仿真或等效测试建议,可提供系统拓扑与典型干扰波形以便进一步分析。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.