WMSIC Electronic Components

BORN SMD0603-005/48N

ModelSMD0603-005/48N
Package0603
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD0603-005 / 48N
Type
BORN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD0603-005/48N
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.019g
Electronic Component
1.85mm
Electronic Component
0.8mm
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0257678983
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
48V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD0603-005/48N — BORN(伯恩) 0603 自恢复保险丝产品概述

一、产品简介

SMD0603-005/48N 是 BORN(伯恩半导体)出品的一款 0603 封装自恢复保险丝(PTC 聚合物电流保护元件)。该器件设计用于低电压、低电流的过流保护场景,在过载或短路时能快速限流并在故障解除后自动恢复,便于SMT量产与小型化电路保护需求。

二、主要技术参数

  • 额定耐压:Vmax = 48V
  • 最大通过电流:Imax = 40A(瞬态或短时通过能力)
  • 保持电流:Ihold = 50mA(正常工作不动作的最大稳态电流)
  • 跳闸电流:Itrip = 150mA(在规定时间内动作的电流)
  • 耗散功率:Pd = 500mW
  • 初始态阻值:Rmin = 3.5Ω
  • 跳断后阻值:R1max = 40Ω(动作后限流电阻)
  • 动作时间:约 1s(在 Itrip 条件下的典型动作时间)
  • 工作温度:-40℃ ~ +85℃
  • 外形尺寸(典型):长 1.85mm × 宽 1.05mm × 高 0.8mm(0603 封装)

三、产品特性与优势

  • 小型化:0603 封装,适合高密度 PCB 布局与便携设备。
  • 自恢复:故障解除后无需更换,降低维护成本。
  • 快速响应:在150mA左右短时间过流时能在约1秒内动作,保护下游电路。
  • 宽工作温度范围,适应多种应用环境。
  • 低待机阻值,保证正常工作时电压降小。

四、典型应用场景

  • 移动设备外围保护(例如传感器、电源开关线)
  • 小型通信设备、模块化接口的过流保护
  • 工业控制低压回路、板级保护
  • USB外围、I/O 口保护(需确认电流规格匹配)
    注:不建议在高功率连续负载中长期使用,适用于短路或短时过流保护。

五、设计与选型建议

  • 确认电路的正常工作电流低于 Ihold,避免误动作。
  • 对励磁或间歇性大电流脉冲,需评估 Imax 与 Pd 能否承受;若脉冲能量大,考虑并联或选用更大规格器件。
  • 布局时保证良好散热路径与焊盘尺寸,避免器件超温影响动作特性。
  • 在高干扰或高温环境下需适当留出裕量,参考厂方温度-电流特性曲线进行降额设计。

六、贴装与可靠性注意

  • 适用常规 SMT 回流焊工艺,推荐按制造商给出的回流温度曲线执行,避免过冲导致性能退化。
  • 焊盘设计遵循 0603 封装规范,避免过量机械应力和焊接翘曲。
  • 储存与使用时避免长时间潮湿环境,必要时进行防潮处理。

七、包装与订购信息

  • 品牌:BORN(伯恩半导体)
  • 封装:0603 SMD
  • 描述分类:未分类(按供应商标签或数据表确认详细型号)
  • 在采购前建议联系供应商获取最新数据手册、典型曲线与样品验证数据,以确保在具体应用中的可靠性与一致性。

以上为 SMD0603-005/48N 的概述与实用指导,若需完整的 I-V 曲线、温度特性或回流焊工艺参数,可提供更详细的数据表或协助评估到板级应用方案。

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