WMSIC Electronic Components

BORN SMD1210-010/60N

ModelSMD1210-010/60N
Package1210
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD1210-010 / 60N
Type
BORN
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD1210-010/60N
Electronic Component
1
Electronic Component
2.8mm
Package
1210
Electronic Component
Resettable Fuse
Electronic Component
0.039g
Electronic Component
3.43mm
Electronic Component
1.15mm
Electronic Component
1
Electronic Component
1.5s
Electronic Component
BM0264583396
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1210-010/60N 产品概述

一、产品简介

SMD1210-010/60N 为 BORN(伯恩半导体)生产的可恢复式自恢复保险丝(PPTC/复位保险器),采用1210贴片封装,专为电路过流保护设计。器件在正常工作时呈低阻状态,当电路出现过电流或短路导致温度上升到触发点时,器件阻值迅速增加,限制电流并保护下游元件;异常解除后随着冷却阻值恢复到初始状态,可重复使用,适合批量贴片和自动化生产。

二、主要性能特点

  • 额定耐压:Vmax 60V,适用于低压至中等电压系统的保护;
  • 最大承受电流:Imax 10A(短时承受能力,非长期额定电流);
  • 保持电流:Ihold 100mA(器件在规定温度下可长期保持不动作的最大电流);
  • 跳闸电流:Itrip 300mA(在标准测试条件下器件将动作并进入高阻状态的电流);
  • 功耗:Pd 600mW(稳态电力耗散能力,影响器件自热与触发行为);
  • 动作时间:典型 1.5s(从过流到进入高阻状态的响应时间);
  • 工作温度范围:-40℃ ~ +85℃,适应工业级环境。

三、电气与机械参数

  • 初始态阻值 Rmin:1.5Ω(常温下的低阻状态);
  • 跳断后阻值 R1max:15Ω(动作后稳态最大阻值,用于限制过流);
  • 封装:1210 SMD,适合回流焊与自动贴装;
  • 尺寸:长度 3.43mm,宽度 2.8mm,高度 1.15mm。

四、典型应用场景

适用于通信设备、消费电子、便携式电源、充电器、工控模块和汽车电子等场景的过流与短路保护,尤其在体积受限且需可恢复保护的板级设计中具有优势。

五、选型与使用建议

  • 选型时以实际工作电流低于 Ihold 为原则,若存在短时浪涌或启动电流,应确认不会触发 Itrip 或采用延时/限流设计;
  • Imax 为短时承受值,不能作为连续工作电流依据;长期负载以热特性和Pd评估;
  • 注意器件在高环境温度下的保持电流会下降,应根据最高工作温度重新评估 Ihold。

六、储存与焊接建议

  • 避免长期暴露在高温高湿环境,按常规湿敏等级和回流焊曲线处理;
  • 建议使用推荐的回流焊温度曲线,避免超过材料极限温度以保证可靠性;
  • 贴装时尽量减少机械应力和弯折,焊膏量与焊盘设计遵循厂方推荐以保证热循环可靠性。

本产品以其小型化、可恢复和高可靠性的特点,适合对重复过流保护有要求且需贴片化生产的应用场合。购买与设计接入前建议参考厂家完整数据手册并在目标环境下进行实测验证。

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