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BORN BAV21W
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BAV21W
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- BAV21W
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Switch Diode
- Electronic Component
- 0.046g
- Electronic Component
- 1
- Electronic Component
- BM0231019406
- Current
- 200mA
- Diode
- Electronic Component
- Current(Ir)
- 100nA@200V
- (Vf)
- 1.25V@200mA
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 250V
- (Trr)
- 50ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAV21W 产品概述
一、产品简介
BAV21W 为独立式开关/整流二极管，来自 BORN (伯恩半导体)，封装为小型 SOD-123。该器件定位为小信号高速开关与低功耗整流应用，具备较高的反向耐压与极低的反向漏电，适合空间受限的消费电子与通讯终端电路使用。
二、主要电气参数
- 正向压降 (Vf)：1.25V @ 200mA
- 直流反向耐压 (Vr)：250V
- 最大整流电流：200mA（连续）
- 耗散功率 (Pd)：500mW
- 反向电流 (Ir)：100nA @ 200V
- 反向恢复时间 (Trr)：50ns
- 非重复峰值浪涌电流 (Ifsm)：2.5A
三、关键特性
- 高反向耐压：Vr=250V，适用于高压信号路径及保护回路。
- 低漏电流：在高压条件下 Ir 仅 100nA，利于漏电敏感的偏置与检测电路。
- 快速恢复：Trr≈50ns，满足一般高速开关与脉冲整流需求。
- 小尺寸封装：SOD-123 占板面积小，便于表面贴装与密集布板设计。
四、典型应用场景
- 高压小信号开关与脉冲整流
- 保护及钳位电路（高压侧）
- 电平移位、限幅与波形整形
- 通信设备、检测仪表与消费类电子中的高压偏置路径
五、选型与使用建议
- 需注意平均耗散功率 Pd=500mW，尽量保证良好散热与合理占空比；在高环境温度或连续大电流条件下应进行功率降额。
- 若电路存在较高浪涌或峰值电流，确认 Ifsm=2.5A 能否满足瞬态要求，必要时采用并联或选用额定更高的器件。
- SOD-123 封装便于自动贴装，但焊接时遵循厂方推荐的回流温度曲线以避免热损伤。
- 对于极低漏电或更快恢复时间的需求，可在设计阶段评估替代型号。
六、包装与可靠性
厂家提供的 SOD-123 独立式封装便于批量贴片与手工焊接，常见于卷带包装。基于规格，该器件适合长期稳定运行，但应按最高额定值和环境条件进行电热管理与应力控制。
如需具体封装图纸、回流焊温度曲线或更详细的电气参数曲线（Vf‑If、Ir‑Vr、Trr 波形等），可联系供应商获取完整数据手册。
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