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BORN SMD1206-100/24N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMD1206-100 / 24N
- Type
- BORN
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMD1206-100/24N
- Electronic Component
- 1
- Electronic Component
- 1.8mm
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.037g
- Electronic Component
- 3.4mm
- Electronic Component
- 1.3mm
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0264491102
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 24V
- Power(Pd)
- 800mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMD1206-100/24N — 可恢复保险丝（BORN 伯恩半导体）
一、产品简介
SMD1206-100/24N 是伯恩半导体推出的1206贴片可恢复保险丝（聚合物自恢复保险装置），适用于表面贴装电路的过流保护。器件额定耐压24V，可在短时浪涌条件下承受高达40A 的脉冲电流，平衡了体积、热阻与保护能力，适合消费类与工业电子的小尺寸电源及接口保护场合。
二、主要电气与机械参数
- 耐压（Vmax）：24 V
- 最大电流（Imax）：40 A（短时浪涌能力）
- 保持电流（Ihold）：1 A
- 跳闸电流（Itrip）：2 A
- 消耗功率（Pd）：800 mW（稳态功耗）
- 初始态阻值（Rmin）：40 mΩ
- 跳断后阻值（R1max）：270 mΩ
- 动作时间：100 ms（在规定过流条件下典型动作时间）
- 工作温度：-40 ℃ ~ +85 ℃
- 外形尺寸：3.4 mm × 1.8 mm × 1.3 mm（1206封装）
三、产品特性与工作原理
该器件属聚合物正温度系数（PPTC）元件：在正常电流下呈低阻状态，发热自稳；当电流超过Itrip并持续一段时间时，器件迅速升温，内阻显著上升至高阻态，从而限制电流，保护线路和负载。过载解除后，元件冷却恢复低阻态，恢复供电连续性，免去更换动作。
四、典型应用场景
- USB/数据接口与充电口防短路、过流保护
- 电池管理与便携设备过流保护
- LED 驱动与背光电路防护
- 小型电源、适配器、开关模块的输入侧保护
- 工业控制与通信设备的局部保护单元
五、设计与使用建议
- 布局时避免将热敏元件、散热器件或高热源紧邻保险丝，以免误动作。
- 若长期工作电流接近Ihold，应选择留有裕量的型号或采用并联/升额方案。
- 评估浪涌能力（Imax）时需考虑峰值持续时间与频率，避免超出器件热承受极限。
- 装焊工艺遵循1206贴片规范，推荐采用标准回流曲线；回流前勿超温存放潮湿器件超过规定时间。
- 在高环境温度下需要适当降额使用，避免长期高温引起漂移或可靠性下降。
六、可靠性与检验
- 建议进行上板后和老化后的初始阻值抽检，确认Rmin在规格内。
- 进行典型过流/浪涌试验以验证动作时间与跳断后阻值（R1max）是否满足要求。
- 关注长期循环热冲击与湿热试验结果，保证在-40 ℃ ~ +85 ℃范围内稳定动作。
七、选型提示与替代方案
当系统电压或持续电流超过本型号额定值时，应选择耐压更高或保持电流更大的同系列产品；若需要更快动作或更低闭态阻值，可考虑不同封装或特殊低阻型号。对于必须保证一次性开断的场合，应选用熔断型保险丝而非可恢复型。
如需样品、封装尺寸图或更详细的热阻/动作曲线数据，请联系供应商或参考伯恩半导体产品手册。
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