Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN SMAJ33A
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMAJ33A
- Type
- BORN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMAJ33A
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.075g
- Electronic Component
- 1
- Electronic Component
- BM0229906769
- Voltage
- 53.3V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 36.7V
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMAJ33A 产品概述
一、产品概述
SMAJ33A 是伯恩半导体（BORN）推出的一款单向 TVS（瞬态电压抑制）二极管，采用 SMA（DO-214AC）封装，专为瞬态过电压和脉冲浪涌保护设计。其典型参数为反向截止电压 Vrwm = 33V，击穿电压 Vbr ≈ 36.7V，钳位电压 Vc = 53.3V，峰值脉冲电流 Ipp = 7.5A，单次脉冲功率 Ppp = 400W（10/1000μs），静态反向漏电流 Ir ≤ 1μA。
二、主要性能亮点
- 单向保护结构，适用于直流电源和信号线的极性敏感场合。
- 低漏电流（≤1μA），适合对静态功耗敏感的系统。
- 高能量吸收能力：400W（10/1000μs）峰值脉冲功率，能有效钳制短时浪涌。
- 快速响应，能在微秒级别钳制瞬态电压，保护后端器件不被瞬间高压损坏。
- SMA 封装兼顾体积与散热，便于手板和量产焊接。
三、典型应用场景
- 工业控制与电源分配总线的浪涌保护（如 24V/36V 系统）。
- 通信设备、基站和网关的电源与接口防护。
- 汽车电子辅助电路（非直接车规级环节）和车载附件防护。
- 消费类电子、安防与监控设备中的端口过压防护。
四、封装与安装建议
SMA（DO-214AC）封装需注意焊接温度曲线与焊盘散热设计，尽量缩短保护器件到地（或电源回路）的走线长度以降低感抗和提升响应效率。对重复脉冲或高频冲击场合，应评估器件热耗散与间歇冷却时间，必要时并联或采用更大功率等级器件。
五、选型与注意事项
- 工作电压选择：Vrwm（33V）应高于系统正常工作电压且留有裕量。
- 钳位电压（53.3V）决定被保护器件承受的最高瞬态电压，关键器件耐压需大于该值。
- 对连续或多次脉冲场合，应参考能量吸收能力并进行热仿真校核。
- 安装时注意极性，单向 TVS 反向耐压特性是其正常工作方式。
SMAJ33A 以其可靠的钳位能力和紧凑封装，适合多类需要中等能量浪涌防护的电子系统，是工程设计中常用的过压保护元件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
