WMSIC Electronic Components

BORN 1SMA4742A

Model1SMA4742A
PackageSMA(DO-214AC)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN 1SMA4742A
Type
BORN
Minimum package
5000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
1SMA4742A
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Zener Diode
Electronic Component
0.11g
Electronic Component
1
(Zzk)
700Ω
(Zzt)
9Ω
Electronic Component
BM0264682184
Diode
1
Current(Ir)
5uA
Power Dissipation(Pd)
1W
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA4742A 产品概述

一、产品简介

1SMA4742A 是一款单管独立式贴片稳压二极管,标称稳压值 12V,封装为 SMA(DO-214AC),额定耗散功率 Pd 为 1W。该器件由 BORN(伯恩半导体)提供,适用于对体积、可靠性和成本有要求的低功率稳压、浪涌保护与电压钳位场景。器件工作结温范围宽(-55℃ ~ +150℃),能够在工业级或较为严苛的环境中长期工作。

二、主要电气参数

  • 稳压值(标称):12V
  • 反向电流(Ir):5 μA(典型/最大值,按出厂测试条件)
  • 耗散功率(Pd):1W(在规定散热条件下)
  • 阻抗 Zzt:9 Ω(代表在规定测试电流下的动态阻抗)
  • 阻抗 Zzk:700 Ω(代表在“膝点”附近的低电流动态阻抗)
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:SMA(DO-214AC),适用于表面贴装工艺

以上参数为器件的典型/关键指标,可用于快速评估在目标电路中的行为。Zzt 与 Zzk 提供了器件在不同工作点下的阻抗信息,有助于估算稳压精度与噪声特性。

三、主要特点与优势

  • 紧凑贴片封装(SMA),便于自动化贴装与波峰/回流焊接工艺。
  • 1W 功率级别,满足小功率稳压与钳位需求,适用于分流式稳压或保护电路。
  • 低反向泄漏(5 μA),适合对待机漏电要求敏感的场合。
  • 宽温度范围(-55℃~+150℃),可靠性高,适合工业级环境应用。
  • 动态阻抗较低(Zzt=9 Ω),在额定电流附近能提供较稳定的稳压特性。

四、典型应用场景

  • 低功率基准电压源与参考电路(需配合限流电阻使用)。
  • 电源线路的浪涌/过压保护(作为瞬态钳位器件)。
  • 通信设备、消费电子的电压钳位和反向电保护。
  • 工业控制与测量设备中对12V等级保护或基准需求的场合。
  • 低功率电池供电系统中的轨电压限制或防反接保护(需根据实际电流计算)。

五、实际选型与应用建议

  • 最大稳流估算:在理想散热条件下,最大连续电流约为 Imax ≈ Pd / Vz = 1W / 12V ≈ 83 mA。但由于封装散热限制与环境温度影响,推荐在设计中使用远小于该理论上限的工作电流,并参照制造商的完整数据表进行热降额。
  • 稳压精度与滤波:为获得更稳定的输出,应在二极管前端串联合适的限流电阻,必要时增加电容滤波以减小噪声与瞬态响应。
  • 温度影响:稳压值会随结温变化而漂移,系统设计需考虑在工作温度范围内的漂移与热耦合,避免长期在高结温下工作。
  • 焊接与工艺:SMA(DO-214AC)兼容常见的 SMT 回流工艺。建议按照器件制造商的回流温度曲线与焊接建议操作,避免过度热应力导致性能退化。
  • PCB 布局:为改善散热性能,器件焊盘应尽量设计为较大铜面积并接地/散热层,必要时在器件底部或附近增加过孔与散热铜皮。

六、可靠性与环境适应性

  • 工作结温范围宽泛,适用于严苛环境与工业级应用。
  • 封装形式适合自动化装配,降低手工安装误差。
  • 采用合适的散热设计与电流限制可以显著延长器件寿命并提高稳压稳定性。

七、替代与兼容

在选型时,如需替代器件,可寻找参数接近的 12V、1W SMA 封装稳压二极管,重点比较稳压点精度、最大耗散功率、反向漏电、动态阻抗及温漂特性。具体替代器件需与目标应用进行仿真与实际验证,确保浪涌承受能力与稳压性能满足要求。

八、结论

1SMA4742A(BORN)是一款面向小功率稳压与保护的 12V SMA 封装稳压管,具有低漏电、较低动态阻抗与宽工作温度范围。在注重体积、成本与自动化装配的电子系统中,可作为参考电压源或过压钳位元件使用。实际应用时应综合考虑散热、限流与温度漂移,并依据完整数据表进行详细的热和电气设计验证。

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