WMSIC Electronic Components

BORN SMFJ6.0A

ModelSMFJ6.0A
PackageSOD-123FL
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMFJ6.0A
Type
BORN
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMFJ6.0A
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0229906771
Voltage
10.3V
Current(Ir)
100uA
Voltage(VBR)
6.67V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMFJ6.0A 产品概述

一、产品简介

SMFJ6.0A 是 BORN(伯恩半导体)推出的一款单向瞬态电压抑制器(TVS),采用 SOD-123FL 表面贴装封装,专为对抗静电放电(ESD)和电磁浪涌(surge)而设计。其稳态反向工作电压(Vrwm)为 6V,击穿电压约 6.67V,能够在典型的 5V 及其附近电源和数据信号线上提供有效的瞬态过压保护。

二、主要性能参数

  • 极性:单向(单向 TVS,针对正向浪涌)
  • 反向截止电压 Vrwm:6.0 V
  • 击穿电压 Vbr:约 6.67 V
  • 钳位电压 Vcl(典型):10.3 V
  • 峰值脉冲电流 Ipp:19.4 A(10/1000 µs 波形)
  • 峰值脉冲功率 Ppp:200 W(10/1000 µs)
  • 反向漏流 Ir:≤100 µA
  • 类型:TVS(瞬态抑制二极管)
  • 封装:SOD-123FL,适合自动贴装生产

三、优势与特点

  • 高能量吸收:200 W(10/1000 µs)脉冲功率能力,能吸收常见电源浪涌和雷击感应能量。
  • 有效钳位:典型钳位电压 10.3 V,在遭受浪涌时可将峰值电压限制在安全范围,保护后端器件。
  • 低漏电流:反向漏流 ≤100 µA,有利于在待机或低功耗应用中减少静态能耗。
  • 小型封装:SOD-123FL 提供紧凑尺寸与良好焊接可靠性,适合空间受限的移动设备与消费电子产品。

四、典型应用场景

  • 5V 系统电源保护(USB、FTDI 芯片、电源总线)
  • 数据线及接口防护(USB、串口、GPIO 等)
  • 通信设备、机顶盒、智能家居与工业控制中的端口防浪涌与ESD
  • 电池管理与充电接口的保护方案

五、使用建议与电路连接

SMFJ6.0A 为单向器件,连接时常见做法是把器件并联在线路与地之间(正极朝向被保护电路)。在 PCB 布局上应遵循短回流路径、最小引线电感的原则:

  • 将 TVS 引脚尽量贴近被保护端口的输入点安装;
  • 保护端点至地的走线短且宽,使用底层大面积地平面;
  • 如为高速信号线,注意并联位置对信号完整性的影响,可采用两端阻尼或差分保护策略。

六、封装与可靠性注意事项

SOD-123FL 为常用的小型 SMD 封装,适合回流焊工艺。储存与贴装过程中注意防潮等级(MSL)与回流温度曲线,遵循厂商推荐的焊接曲线以避免封装损伤。对于长期的脉冲暴露,应评估器件的累积热应力与可能的退化,关键系统可考虑冗余或更高功率等级的 TVS 作为备份保护。

七、选型提示

在选用 SMFJ6.0A 时,建议依据系统最大工作电压选择 Vrwm,确保 Vrwm 大于系统正常工作电压且小于被保护器件耐压。同时参考峰值脉冲电流和钳位电压,确认在最恶劣浪涌条件下后端元件不会超过其极限电压。若系统对漏电流或钳位电压有更严格要求,可比较同系列或其他封装/型号以获得最优平衡。

如需进一步的电气特性曲线(I-V 曲线、钳位随电流变化曲线)、封装尺寸图或回流焊工艺建议,我可以为您提供更详尽的数据表及布局示例。

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