Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN BZT52B15
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BZT52B15
- Type
- BORN
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BZT52B15
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.034g
- Electronic Component
- 1
- (Zzk)
- 200Ω
- (Zzt)
- 30Ω
- Electronic Component
- BM0228551990
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 14.7V~15.3V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52B15 产品概述
一、产品简介
BZT52B15 是 BORN（伯恩半导体）出品的一款 15V 稳压二极管，采用 SOD-123 表面贴装封装，适合体积敏感的整流、稳压与浪涌保护应用。该器件在反向稳压区域工作，可作为简易稳压源、基准和浪涌钳位器使用。
二、主要参数
- 稳压值（标称）：15V
- 稳压范围：14.7V ~ 15.3V
- 反向电流 Ir：100nA @ 10.5V
- 耗散功率 Pd：500mW（最大）
- 阻抗 Zzt：30Ω
- 阻抗 Zzk：200Ω
- 封装：SOD-123（表面贴装）
- 品牌：BORN（伯恩半导体）
三、性能要点与使用注意
由于最大耗散功率为 500mW，在稳压电压 15V 下最大允许稳流约为 0.5W / 15V ≈ 33mA；为保证可靠性与热裕量，建议在实际设计中使用明显低于该值的工作电流（常见建议工作点约 1–10mA，典型 3–5mA）并通过串联限流电阻控制电流与功耗。Zzt（动态阻抗）为 30Ω，表明在规定测试工作电流下具有较好的稳压性能；Zzk 较高（200Ω）提示在接近击穿前沿或低电流区域稳压特性变差，应避免极低电流长期使用以免稳压漂移和噪声增加。反向漏电在 10.5V 时仅 100nA，适合对泄漏敏感的低功耗场合。
四、典型应用
- 小型电源的并联稳压（并联式基准/钳位）
- 过压保护与浪涌钳位（与限流电阻配合）
- 模拟电路参考电压源、偏置网络
- 电子玩具、仪表和通信终端等空间受限的消费类电子
五、封装与装配建议
SOD-123 小型封装适合自动贴片生产；考虑到热阻较大，建议在 PCB 设计时提供适度的铜箔散热、缩短引线并尽量降低稳态功耗。同时在高温或高散热约束下应重新评估最大允许电流以避免超过 Pd 限值。
六、结论
BZT52B15 在小型化、低漏电和中等稳压精度场合具有良好性价比。设计时应重视功耗与热管理，选定合适的工作电流区间与限流电阻，以充分发挥其稳压与保护功能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
