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BORN SMDJ18CA
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMDJ18CA
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMDJ18CA
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.408g
- Electronic Component
- 1
- Electronic Component
- BM0227277163
- Voltage
- 29.2V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 20V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMDJ18CA 产品概述
一、产品简介
SMDJ18CA（BORN 伯恩半导体）是一款双向瞬态电压抑制器（TVS），采用 SMC（DO-214AB）表面贴装封装，专为保护电子线路免受瞬态过压和脉冲能量冲击而设计。器件响应迅速、承受能力高，适合工业、电源及车载周边的浪涌保护需求。
二、主要参数
- 类型：TVS（二极双向）
- 极性：双向
- 反向截止电压 Vrwm：18 V
- 击穿电压（典型）：约 20 V
- 钳位电压 Vc：29.2 V（对应额定脉冲测试条件）
- 峰值脉冲电流 Ipp：102.7 A
- 峰值脉冲功率 Ppp：3 kW（测试波形 10/1000 µs）
- 反向漏电流 Ir（在 Vrwm 下）：1 µA
- 封装：SMC (DO-214AB)
- 品牌：BORN（伯恩半导体）
三、工作原理与关键特性
SMDJ18CA 在正常工作电压下呈高阻状态，漏电流极小（约 1 µA），当线路上出现短时高能电压尖峰时，器件在击穿区迅速导通，将过压钳位在约 29.2 V 并吸收能量，从而保护下游元件。其 3 kW（10/1000 µs）峰值脉冲功率和超过 100 A 的瞬态电流承受能力，使其适用于高能量冲击场景；双向结构可同时抑制正、负极性浪涌，省去反向配置的需求。
四、典型应用
- 12 V/24 V 电源系统输入端浪涌保护（例如汽车电子、工业控制）
- 开关电源与逆变器的端子保护
- 通信接口、信号线和数据总线（当需要高能量抑制时）
- 工业设备及建筑配电的瞬态保护模块
五、封装与安装建议
SMC（DO-214AB）为常见的高功耗表面贴装封装，具有良好散热与机械强度。安装时建议：
- 将器件放置在被保护点与电源/信号入口尽可能近的位置；
- 走线尽量短且宽，减少串联电感和附加阻抗；
- 对于高能量应用，增加地平面和热沉、必要时增设热 vias 以加强散热；
- 遵循制造商推荐的回流焊温度曲线，避免过热影响可靠性。
六、选型与注意事项
- 选型时 Vrwm（18 V）应略高于系统正常工作电压，以避免误触发；对于 12 V 汽车系统通常为合适选择。
- 钳位电压 29.2 V 为典型测试值，实际电路中钳制电压会随测试波形和PCB布局略有变化。
- Ppp 标注基于 10/1000 µs 波形，若需应对不同波形（如 8/20 µs），需参考完整数据表或进行实际测试。
- 长时间或重复高能量脉冲会导致器件发热或损坏，应评估系统中浪涌发生频率并考虑冗余或限制电路。
七、总结与建议
SMDJ18CA（BORN）是一款面向高能量瞬态防护的双向 TVS 器件，适用于需要高峰值功率吸收且要求低漏电的场合。使用时请结合系统电压、浪涌波形与PCB布局进行综合评估，必要时参阅厂家完整数据手册以获取温度特性、能量循环寿命及封装尺寸等详细信息。若需替换或并联使用，请与供应商确认兼容性与热管理方案。
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