WMSIC Electronic Components

BORN BZT52C27

ModelBZT52C27
PackageSOD-123
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BZT52C27
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BZT52C27
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.034g
Electronic Component
1
(Zzk)
300Ω
(Zzt)
80Ω
Electronic Component
BM0228561620
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
500mW
Electronic Component
25.1V~28.9V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C27 稳压二极管 产品概述

一、产品简介

BZT52C27 为伯恩半导体(BORN)出品的独立式稳压二极管,标称稳压值 27V,封装为 SOD-123。该器件为表贴型、低功耗的单体稳压二极管,适合用于需要中等电压钳位与简单参考源的消费电子与工业控制电路。

二、主要参数

  • 稳压值(标称):27V
  • 稳压值范围:25.1V ~ 28.9V
  • 反向电流 Ir:100 nA(注:100 [email protected] 为厂家给定的测试点)
  • 最大耗散功率 Pd:500 mW(在规定散热条件下)
  • 阻抗 Zzt:80 Ω(在规定测试电流下的动态阻抗)
  • 阻抗 Zzk:300 Ω(于击穿起始区域的阻抗)
  • 封装:SOD-123,适合表面贴装工艺

三、核心特性与工程意义

  • 低漏电流:在 18.9V 测试点漏电仅 100 nA,表明器件在接近击穿前的静态泄漏很小,有利于低静态电流应用与电压检测电路。
  • 中等动态阻抗:Zzt≈80 Ω 表明在工作电流附近输出并非超精密参考,滤波与稳定电流源设计需考虑该阻抗带来的电压漂移;Zzk≈300 Ω 说明在击穿起始区电压变化对电流敏感,启动时电压有较大摆动。
  • 功率限制:Pd=0.5W 限制了可通过稳压二极管的最大电流(见下计算),不适合做大功率稳压或吸收大型瞬态能量。

四、典型应用场景

  • 作为 27V 的电压钳位/保护(例如保护敏感电路不受过压冲击)。
  • 作为参考电压源或电压检测节点(在允许较大误差与较低工作电流时)。
  • 小功率电源或控制电路中的过压保护与基准电路。

五、使用建议与选型注意事项

  • 最大稳压工作电流估算:Iz_max ≈ Pd / Vz = 0.5W / 27V ≈ 18.5 mA。为保证可靠性与寿命,实际工作电流应适当降额(建议常用 Iz 在 1–10 mA 范围,视散热条件而定)。
  • 串联限流电阻设计示例:若输入电压为 48V,期望通过稳压二极管 Iz ≈ 5 mA,则 R ≈ (48−27) / 5 mA ≈ 4.2 kΩ,R 的额定功率要能承受 (Vin−Vz)*Iz。
  • 考虑动态阻抗:若对稳压精度有更高要求,应使用低阻抗稳压元件或用稳压芯片配合基准源。BZT52C27 更适合做钳位与一般参考。
  • 温度与数据表:本描述基于关键参数摘要,详尽的温度系数、测试电流点及典型曲线应参照厂家完整数据手册,特别是在温度极限与长期稳定性方面。
  • 封装与焊接:SOD-123 需按厂商推荐的 PCB land pattern 与回流工艺安装,注意热阻较大时需考虑散热。

六、封装与热管理

SOD-123 为常用的表贴小封装,便于自动贴装与批量生产,但其热阻相对较高,器件的 Pd 受 PCB 铜箔面积与环境温度影响明显。建议在需要更高耗散能力时增大焊盘面积或添加散热铜箔,并在布局时避免将热敏元件紧邻高发热器件。

七、结论与选型建议

BZT52C27(27V,SOD-123)适用于中低功率的电压钳位与一般参考场合,优点为封装小、漏电小、易于贴装。若应用要求更高的稳压精度、低动态阻抗或更大功率承受能力,应考虑更低阻抗的稳压器件或更高功率封装的齐纳二极管。购买与设计时务必对照完整数据表核实测试条件与温度相关特性。

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