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BORN 1SMB5927B
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN 1SMB5927B
- Type
- BORN
- Minimum package
- 3000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- 1SMB5927B
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Zener Diode
- Electronic Component
- 0.181g
- Electronic Component
- 1
- (Zzk)
- 550Ω
- (Zzt)
- 6.5Ω
- Electronic Component
- BM0231019424
- Diode
- 1
- Current(Ir)
- 1uA
- Power Dissipation(Pd)
- 3W
- Electronic Component
- 11.4V~12.6V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMB5927B 产品概述
一、产品简介
1SMB5927B 是由 BORN（伯恩半导体）推出的一款 SMB（DO-214AA）封装的稳压二极管，设计用于在约 12V 档位提供稳定的电压参考与过压/浪涌抑制能力。器件工作结温范围宽（-55℃ ~ +150℃），适合多种工业与消费电子应用中对可靠性与温度耐受性的需求。
二、主要电气参数
- 稳压值（范围）：11.4V ～ 12.6V
- 反向电流（Ir）：1 μA（典型/最大漏电小，适合高阻负载或低功耗场合）
- 耗散功率（Pd）：3 W（在规定散热条件下的最大功耗）
- 阻抗 Zzk：550 Ω（低电流区或转折点处的高阻抗特性）
- 阻抗 Zzt：6.5 Ω（较高电流区的动态阻抗，体现稳压能力）
- 工作结温范围：-55℃ ～ +150℃
注：Zzk 与 Zzt 为器件在不同工作点/测试条件下的阻抗指标，实际电气特性依赖测试电流和环境热条件，设计时请参考完整数据表。
三、封装与机械特性
1SMB5927B 采用 SMB（DO-214AA）表面贴装封装，特点包括：
- 适配自动化贴装与回流焊工艺，便于批量生产
- 良好的散热与机械强度，适合中功率稳压/浪涌抑制应用
- 占板面积适中，可在有限 PCB 空间内提供较高的功率承载能力
四、应用场景
- 12V 电源轨的稳压与参考源，适用于工业控制、仪器仪表与通信设备
- 电源浪涌或瞬态过压保护（配合限流或串联电阻使用效果更佳）
- 消费电子与外围模块的电压钳位与稳压修正
- 需在高/低温环境中长期工作的系统
五、设计与热管理建议
- 耗散功率 Pd 为 3W，但该值依赖在特定温度引脚/基板条件下测得，PCB 设计时应为器件提供充分的散热路径（加大铜箔面积、使用过孔或散热垫）。
- 在高环境温度或连续高功耗工况下需按厂家热阻与结温曲线进行功耗降额计算，避免超过器件最大结温。
- 建议遵循标准 SMT 回流焊工艺进行焊接，避免过热或长时间高温暴露；存储与搬运按一般半导体防静电、防潮措施执行。
- 使用时注意极性与布局，稳压二极管通常以反向击穿工作，接线方式和限流元件需验证稳压点与散热能力。
六、可靠性与选型注意事项
- 宽工作结温（-55℃ ~ +150℃）体现出较好的温度鲁棒性，但若用于汽车级或关键安全系统，请确认是否具有相应的车规认证（AEC 等）。
- 在最终设计中应参照完整数据手册核对所有测试条件（如测试电流、温度条件、封装热阻等），并在样机阶段做热稳态与浪涌试验验证。
- 选型时如需更低漏电、更高功率或不同稳压点，可比较同系列或其他厂商相近规格件。
七、总结
1SMB5927B 是一款面向约 12V 稳压与瞬态抑制的 SMB 封装二极管，具有低漏电、高温耐受与中等功率耗散能力，适用于多种需要稳压或过压保护的电子设计。为确保长期可靠性，建议在设计阶段充分考虑散热管理与实际工作电流条件，并以厂方完整数据手册为准进行最终验证。
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