WMSIC Electronic Components

BORN BSD3C121V

ModelBSD3C121V
PackageSOD-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BSD3C121V
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BSD3C121V
Electronic Component
1
Package
SOD-323
Electronic Component
Electronic Component
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.031g
Electronic Component
1
Cj- Capacitor
30pF
Electronic Component
BM0226246929
Voltage
26V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
13.3V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSD3C121V TVS二极管产品概述

一、产品简介

BSD3C121V 是伯恩半导体(BORN)推出的一款用于瞬态抑制的双向 TVS(瞬态电压抑制)二极管,封装为 SOD-323。该器件针对 12V 等级系统及信号线的过压、浪涌和静电放电事件提供快速、可靠的保护,适用于工业、通信、消费电子等需抗干扰与浪涌保护的场合。

二、主要电气参数

  • 钳位电压(Vc):26 V(典型,测试条件 8/20μs)
  • 击穿电压(Vbr):13.3 V(参考值)
  • 反向工作电压Vrwm:12 V
  • 峰值脉冲功率Ppp:260 W(8/20μs)
  • 峰值脉冲电流Ipp:10 A(8/20μs)
  • 反向漏电流Ir:1 μA(在 Vrwm 条件下)
  • 结电容Cj:30 pF(典型)
  • 极性:双向(Bidirectional)
  • 防护等级/符合标准:IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)、IEC 61000-4-5(浪涌)
  • 封装:SOD-323(小体积,适合表面贴装)

三、关键特性与优势

  • 双向结构:可同时抑制正向和负向极性瞬态脉冲,适合交流/差分对称信号和非极性电路的保护。
  • 高浪涌承受能力:在标准 8/20μs 测试波形下,器件可承受高达 260 W 的瞬态能量,峰值电流 10 A,有效吸收较大能量的浪涌。
  • 低漏电流:1 μA 的反向漏电流在 12 V 工作电压条件下,可最大限度减少对被保护电路的静态功耗影响。
  • 中等结电容(30 pF):兼顾保护性能与信号完整性,对中低速信号线路影响较小;但在超高速或高频敏感线路中仍需评估电容影响。
  • 小型封装:SOD-323 占板面积小,便于在空间受限的 PCB 上实现局部保护。

四、典型应用场景

  • 12V 汽车电子(非关键安全路径,如车身电子模块)与工业 12V 电源总线的瞬态保护(注意需按车规级要求选型)。
  • 通信接口与数据线保护(如差分信号对、低速串行接口、CAN、LIN 等)。
  • 消费类与工业设备的输入电源和信号端口防护,防止 ESD、EFT 及雷击感应的短时过压。
  • 传感器接口、继电器驱动端口等容易受到浪涌影响的节点。

五、PCB 布局与使用建议

  • 尽量将 BSD3C121V 贴近被保护的引脚或接口,缩短连接导线长度,以降低寄生感抗和提升抑制效率。
  • 走线要短且宽,尤其是从保护器件到接地点(GND,若为单向器件)或两端连接的回流路径,应保持最短路径。双向器件在差分线上应置于差分对两线的直接路径上。
  • 尽量避免在 TVS 两端串联其他元件(如电阻、电感),否则会影响瞬态电流的泄放路径与钳位效果。
  • 对于高能量脉冲,考虑在 PCB 下方设置足够的散热铜层与过孔,以分散和引导热量;但 SOD-323 尺寸及能耗有限,应注意热平衡。
  • 在高速信号应用中,需评估 30 pF 结电容对信号带宽的影响;必要时考虑选用低容抗的 TVS 器件或在系统级做补偿。

六、可靠性与标准

BSD3C121V 满足 IEC 61000-4-2(静电放电)、IEC 61000-4-4(电快速瞬变脉冲群)和 IEC 61000-4-5(浪涌) 等抗扰度标准,适合常见的工业与民用电磁干扰场景。实际使用时应结合系统的测试规范(如接触放电电压等级、浪涌电流等级)进行验证与配套试验。

七、选型注意事项

  • 工作电压匹配:Vrwm = 12 V,适用于标称 12 V 电源或接近 12 V 的信号总线;若系统电压显著高于 12 V,应选用相应 Vrwm 更高的型号。
  • 钳位与容差:钳位电压 26 V 为典型值,设计时需考虑被保护器件能否承受此电压峰值。
  • 高频特性:30 pF 的结电容在高频或高速数据链路上会带来一定影响,关键高速接口请进行信号完整性评估。
  • 封装与装配:SOD-323 为小封装,便于贴片组装与批量生产;装配时按厂商回流焊工艺规范操作,注意焊接热循环对器件性能的影响。

总结:BSD3C121V 以其稳健的浪涌吸收能力、双向保护特性与小型封装,适合为 12V 等级的电源及中低速信号线提供高效的瞬态抑制保护。在实际应用中,通过合理的 PCB 布局与对电压/能量级别的评估,可获得可靠的抗扰动性能。若需要更高能量或更低电容版本,请根据具体系统需求继续筛选或咨询供应商。

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