WMSIC Electronic Components

BORN SMD1206-100/16N

ModelSMD1206-100/16N
Package1206
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD1206-100 / 16N
Type
BORN
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD1206-100/16N
Electronic Component
1
Electronic Component
1.8mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.039g
Electronic Component
3.4mm
Electronic Component
1.15mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0265006879
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206-100/16N 产品概述

一、产品简介

SMD1206-100/16N 是 BORN(伯恩半导体)推出的一款 1206 封装聚合物可恢复保险丝(Polymeric PTC resettable fuse)。该器件用于对过流和短路提供自动限流保护,发生过流后能在断电或故障消除后自动恢复导通,适合空间受限的表贴电路保护应用。

二、主要参数

  • 耐压(Vmax):16 V
  • 最大瞬态电流(Imax):100 A
  • 保持电流(Ihold):1 A
  • 跳闸电流(Itrip):2 A
  • 消耗功率(Pd):≈800 mW(在约定测试条件下)
  • 初始态阻值(Rmin):40 mΩ
  • 跳断后阻值(R1max):≤250 mΩ
  • 动作时间:约 100 ms(视过流幅度和环境温度而定)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 尺寸:3.4 mm × 1.8 mm × 1.15 mm(1206 封装)

三、性能与特性

  • 低阻抗:初始阻值仅约 40 mΩ,有利于降低正常工作时的压降与发热。
  • 快速触发:当电流超过 Itrip(约 2 A)时,典型动作时间约 100 ms,可迅速限制故障电流。
  • 自动复位:故障消除并冷却后,器件阻值恢复,便于重复保护,降低维护成本。
  • 高峰值承受能力:可承受短时脉冲或浪涌电流至 100 A(瞬态),适应突发事件。
  • 宽温度范围:-40 ℃~+85 ℃,适合多种工业与消费类环境。

四、典型应用

  • USB、摄像头、移动设备的端口与电源保护
  • 电池管理系统的前级保护与充电电路
  • LAN/通信设备、机顶盒、路由器等小型电子设备
  • LED 驱动、便携式仪器以及任何需点到点过流保护的板级电路

五、选型与使用建议

  • 额定电压:系统工作电压应低于 16 V,建议留有裕量以提升可靠性。
  • 电流裕量:设计时保持正常工作电流低于 Ihold(1 A),以避免不必要跳闸;若工作电流接近 1 A,应考虑选择更高 Ihold 等级。
  • 布局与散热:1206 封装尺寸小,贴片焊盘与周围铜皮会影响器件热行为。避免将器件紧邻高功率热源,必要时减少大铜面或使用热隔离以保证动作一致性。
  • 焊接工艺:兼容常规 SMT 回流工艺;建议参考厂商数据表获得推荐回流曲线以确保可靠焊接。
  • 验证测试:在目标系统温度、封装热阻和实际浪涌条件下进行验证,确认动作点、恢复时间与长期稳定性。

六、可靠性与包装

BORN 产品通常满足 RoHS 要求并经严格出厂检测,但具体认证(如UL)以出厂资料为准。器件适合自动贴片生产,常见包装为卷带供料(Tape & Reel),便于高速 SMT 贴装。

总结:SMD1206-100/16N 是一款小尺寸、低阻、响应快的聚合物可恢复保险丝,适用于对空间与成本敏感且需反复过流保护的消费与工业类电子产品。选择与布局时应关注工作电流裕度与热管理,以确保稳定可靠的保护效果。

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