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BORN SS54SMC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SS54SMC
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- SS54SMC
- Electronic Component
- 1
- Package
- SMC
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.351g
- Electronic Component
- 1
- Electronic Component
- BM0227656408
- Current
- 5A
- Diode
- 1
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@5A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 40V
- Surge Current (Ifsm)
- 150A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS54SMC 产品概述
一、产品简介
BORN（伯恩半导体）出品的 SS54SMC 是一种高可靠性的肖特基整流二极管，额定整流电流为 5A、反向耐压 40V，采用 SMC（DO‑214AB）表面贴装封装。典型正向压降为 0.55V（在 IF=5A 时），具有低正向压降、快速恢复特性与较小的反向漏电流，适用于中功率开关电源和整流应用场景。
二、主要电气参数
- 正向压降 (Vf)：0.55V @ IF = 5A（典型）
- 直流反向耐压 (Vr)：40V
- 额定整流电流：5A（连续）
- 反向电流 (Ir)：500µA @ VR = 40V（典型）
- 非重复峰值浪涌电流 (IFSM)：150A（8.3ms 半正弦波）
- 工作结温范围：-65°C 至 +150°C
三、主要特性与优势
- 低正向压降：在大电流条件下降低功耗和发热，提高系统效率。
- 快速开关响应：肖特基结构减小恢复时间，适合高频开关电源和开关整流用途。
- 良好的浪涌承受能力：150A 的单次峰值浪涌电流能力，能应对启动及瞬态过载。
- 宽温度范围：适用于工业级及严苛环境的可靠工作需求。
- SMC 封装：较好的散热性能与焊接可靠性，便于自动贴装生产。
四、封装与热管理
SS54SMC 采用 SMC（DO‑214AB）封装，底部焊盘面积较大，有利于热量传导到 PCB。实际散热性能依赖于 PCB 铜箔面积和对流条件。为保证可靠工作，应在布局中增大焊盘和热铜层，必要时配置散热铜箔或散热片以降低结温。
五、典型应用场景
- 开关电源二次整流（同步替代或独立整流）
- DC-DC 转换器输出整流
- 逆向保护与反向电流阻断
- 电机驱动、功率模块的回流整流
- 汽车电子、工业电源与消费类电源应用（在允许的电压/温度范围内）
六、电路设计与使用注意事项
- 反向漏电随温度急剧上升，若工作温度较高须验证在最大 VR 下的 Ir 是否符合系统要求。
- 在大电流脉冲场合，考虑并联或选用更高 Ifsm 等级器件；并联时需注意均流与寄生参数。
- PCB 布局应增大焊盘和接地/电源铜面积，缩短与电流路径相关的走线以减小寄生电感与发热。
- 焊接须遵守厂商推荐的回流曲线，避免过高温度或过长回流时间影响器件可靠性。
七、可靠性与储存
器件适用结温范围 -65°C 至 +150°C，长期高温工作会加速老化。储存时避免潮湿与静电损伤，若为潮湿敏感器件（MSL）等级，请按回流前的干燥步骤处理。
八、选型与替代
SS54SMC 以其 5A/40V 的参数在中功率整流领域广泛使用。若需要更低正向压降或更低漏电，可选择同类低漏肖特基或同步整流方案；若需要更高电流或更高耐压，可参考同系列更高电流或更高 Vr 的型号。
如需样片、封装数据表（含完整绝对最大额定、典型特性曲线与回流焊工艺），建议联系 BORN（伯恩半导体）或代理商索取官方数据手册以便电路验证与可靠性评估。
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