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BORN BGC08C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BGC08C
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BGC08C
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Electronic Component
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 1pF
- Electronic Component
- BM0263483717
- Voltage
- 27V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 1uA
- Voltage(VBR)
- 9V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BGC08C 产品概述
一、特性概述
BGC08C 为伯恩半导体（BORN）推出的一款双向瞬态抑制二极管（TVS），专为高速通信与移动终端的瞬态浪涌和静电放电保护设计。器件支持 8/20μs 波形下 350W 峰值脉冲功率，具有低钳位电压、低漏电流和极低结电容（典型 1.0 pF），对高速差分信号干扰小，保证信号完整性。
二、主要电气参数
- 极性：双向
- 反向截止电压 Vrwm：8 V
- 击穿电压 VBR：9 V
- 钳位电压（典型）：27 V（Ipp = 15 A, 8/20μs）
- 峰值脉冲电流 Ipp：15 A（8/20μs）
- 峰值脉冲功率 Ppp：350 W（tp = 8/20μs）
- 反向电流 Ir：≤ 1 μA
- 结电容 Cj：典型 1 pF
- 通道数：单路
- 防护等级：满足 IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5标准
三、典型应用场景
- 以太网接口保护（10/100/1000Base‑T）：低电容特性适合高速差分对，尤适用于对信号失真敏感的接口。
- 手机和移动终端：保护电源线、天线接口与数据口免受 ESD 与浪涌侵害。
- 工业与消费类电子的小型化防护方案：在空间受限的系统中提供有效瞬态吸收能力。
四、封装与安装
- 封装形式：SOD‑323，体积小、适合高密度贴装。
- 安装建议：采用常规回流焊工艺，注意遵循封装极小器件的温度曲线与回流要求。根据电路拓扑，可将 BGC08C 并联置于被保护线路上（跨线或线对地方式，视具体电路设计而定），以实现对高幅值瞬态的钳位与吸收。
五、选型与注意事项
- 若系统工作电压接近或高于 Vrwm（8 V），请确认击穿与钳位行为是否满足系统安全裕量。
- 对于差分高速信号，典型 1 pF 结电容可最大限度降低对信号的影响，但仍需在 PCB 布线和阻抗匹配上进行同步优化。
- 钳位电压 27 V 在大多数通信接口发生浪涌时能提供有效保护，但需评估后级器件对短时高压的耐受性。
- 在有重复或持续浪涌场景下，注意器件的热耗散能力与整体热管理。
六、合规与可靠性
BGC08C 满足 IEC 61000‑4‑2（接触放电/空气放电 ±30 kV）、IEC 61000‑4‑4 和 IEC 61000‑4‑5 等抗干扰与浪涌标准要求，适合需要通过国际电磁兼容认证的整机方案。低漏电与高脉冲承受能力保证长期稳定性，适合严苛电气环境下的防护设计。
总结：BGC08C 以其小封装、低电容、高脉冲吸收能力和全面的抗扰动性能，是保护以太网接口与移动设备电源/信号线的理想选择。在实际应用中，请结合系统电压、信号特性与热设计进行合理布局与选型。
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