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BORN BAS16
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BAS16
- Type
- BORN
- Minimum package
- 3000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BAS16
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0264682193
- Current
- 150mA
- Current(Ir)
- 1uA
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 225mW
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS16 产品概述
BAS16（品牌：BORN 伯恩半导体，封装：SOT-23）是一款面向低功耗高速开关与整流应用的小信号二极管。器件在小体积封装下提供较高反向耐压与快速恢复特性，适合便携设备和空间受限的电路板设计。
一、主要特性
- 耗散功率 Pd：225 mW（注意需在器件允许的结温下散热）
- 整流电流 I_F(AV)：150 mA（持续直流）
- 直流反向耐压 V_R：75 V
- 正向压降 V_F：1.25 V @ 150 mA
- 非重复峰值浪涌电流 I_FSM：2 A
- 反向电流 I_R：1 µA（典型、常温）
- 反向恢复时间 T_rr：9 ns（快速开关）
- 工作结温范围：-55 ℃ ～ +150 ℃
二、典型应用场景
- 低电流快速开关与整流（脉冲信号路径、逻辑电平整形）
- 保护与钳位电路（防反接、过压旁路）
- 通讯和射频前端的信号抽取、隔离与切换
- 便携式电源和电池管理中用于能耗敏感的路径
三、设计与使用建议
- 熔断与热管理：Pd 225 mW 为器件在规定结温下的最大耗散，实际使用时需按PCB铜箔面积与通孔散热计算功耗与结温，避免长时间接近极限功率。
- 开关性能：T_rr = 9 ns 表明适合中高速开关，但在高速或大电流切换中应注意反向恢复引起的瞬态应力。
- 浪涌能力：Ifsm = 2 A 提供短时浪涌保护，但频繁浪涌会热损伤，设计时应防止重复冲击。
- 漏电与温度：IR 随温度上升显著增加，精密低漏电场合需特别注意高温下的漏电行为。
四、封装与选型注意
SOT-23 封装适合表贴与紧凑布局。选型时建议向供应商确认完整数据手册（温度特性、典型曲线、封装引脚图与标识），并注意焊接工艺和储存条件以保证可靠性。
综上，BAS16 是一款在体积、耐压与开关速度之间取得平衡的通用小信号二极管，适合对体积和性能有中等要求的消费电子与工业控制场景。
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