Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN BZT52B6V8
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BZT52B6V8
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BZT52B6V8
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- (Zzk)
- 80Ω
- (Zzt)
- 15Ω
- Electronic Component
- BM0264583402
- Diode
- 1
- Current(Ir)
- 2uA
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 6.66V~6.94V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52B6V8 产品概述
一、概述
BZT52B6V8 是一款由 BORN（伯恩半导体）提供的独立式稳压二极管，标称稳压值为 6.8V，采用 SOD-123 小型封装，外壳为模压塑料，环氧树脂符合 UL 94V-0。该器件适用于空间受限的稳压、基准与浪涌钳位等应用场合。
二、主要电气参数
- 标称稳压值：6.8V（BZT52B6V8）
- 稳压值范围：6.66V ～ 6.94V
- 反向电流 Ir：2μA（典型/最大等级，按规格条件测量）
- 耗散功率 Pd：500mW（在规定环境与散热条件下）
- 稳压阻抗 Zzt：15Ω
- 膝点阻抗 Zzk：80Ω
以上参数表明器件在小电流工作点下提供稳定的电压参考，但在较大负载变化时会有一定的内阻产生压降，应在设计中考虑阻抗与功耗限制。
三、封装与极性
- 封装类型：SOD-123 塑料封装，适合贴片工艺（SMT）
- 极性标识：色带表示阴极（请按色带方向焊接）
- 封装材料：模压塑料，环氧树脂等级 UL 94V-0，具有一定的阻燃性能
SOD-123 封装体积小，便于在双面贴装或空间受限的电路板上使用，但热阻相对较高，需注意功耗热管理与封装散热条件。
四、典型应用场景
- 小功率稳压与参考电压源（如传感器、ADC 参考）
- 电路保护与浪涌钳位（限流配合使用）
- 通信设备、便携式电子产品、电源管理模块中的局部稳压器
在做参考电路时，建议配合限流电阻或主动稳压结构，以控制器件在额定耗散功率内工作并改善动态响应。
五、使用与封装设计建议
- 热管理：500mW 是器件在良好散热条件下的最大耗散，应考虑 PCB 铜箔面积或热导路径进行功耗热抑制；在高温条件下须降额使用。
- 焊接工艺：兼容回流焊，注意焊接温度曲线与制造商推荐的热规程。
- 存储与搬运：避免潮湿、静电放电，使用防静电包装并按湿敏等级处理（若适用）。
- PCB 布局：在 SOD-123 焊盘周围预留热沉铜箔，尽量缩短引线以降低附加阻抗。
六、订购信息与选型提示
型号：BZT52B6V8，品牌：BORN（伯恩半导体），封装：SOD-123。选型时注意稳压值公差、阻抗与功耗是否满足系统动态负载与温度要求；若需更高功率或更低阻抗，可考虑更大封装或并联使用并作电流均衡设计。
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