WMSIC Electronic Components

BORN GS5M

ModelGS5M
PackageSMC
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN GS5M
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
GS5M
Electronic Component
1
Package
SMC
Electronic Component
General Purpose Diode
Electronic Component
0.36g
Electronic Component
1
Electronic Component
BM0264595488
Current
5A
Diode
1
Current(Ir)
5uA
(Vf)
1.1V@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GS5M 产品概述

一、主要参数与特性

GS5M 是一款单只独立封装的高压整流二极管,适用于需要稳定高压耐受和中等直流整流电流的电源与工业应用。主要电气参数如下:

  • 正向压降 (Vf):1.1 V @ 5 A
  • 直流反向耐压 (Vr):1000 V
  • 额定整流电流:5 A(连续)
  • 反向漏电流 (Ir):5 μA(常温下)
  • 非重复峰值浪涌电流 (Ifsm):300 A(单次浪涌)
  • 工作结温范围:-55 ℃ ~ +150 ℃

封装与材料:

  • 封装类型:DO-214AB (SMC),便于表面贴装与散热设计
  • 封装材料:模塑料满足 UL 94 V-0 阻燃等级,符合 RoHS 要求且无卤
  • 端子处理:镀锡引线,符合 J-STD-002 与 JESD22-B102 可焊性要求
  • 极性标识:色带表示阴极端,便于装配识别

二、应用场景与优势

GS5M 适用于多种高压整流与保护场景,典型应用包括:

  • 开关电源(SMPS)高压整流与逆向保护
  • 工业电源、逆变器与电机驱动中的整流与自由轮回路
  • 电池充电器、高压直流链路及功率模块中的箝位与浪涌吸收
  • 高频开关与半桥/全桥拓扑中的回流二极管

其主要优势在于高达 1 kV 的反向耐压和 5 A 的连续整流能力,配合 300 A 的单次浪涌承受能力,能满足中高压系统的可靠整流需求;DO-214AB(SMC)封装为散热和机械强度提供良好平衡。

三、热管理与可靠性建议

  • PCB 布局:建议在封装下方和引脚处使用大面积铜箔和多层过孔(vias)将热量导出至内部或背面散热层,以降低结温。
  • 散热设计:在高功率或高占空比场合,应配合外部散热器或铜柱以保证结温在安全范围内,避免因长期高温造成参数漂移。
  • 浪涌处理:Ifsm 为非重复峰值,应避免频繁的大幅浪涌,必要时并联浪涌限流器或保险丝、使用合适的吸收电路以延长寿命。
  • 环境与寿命:在极端高温、潮湿或有腐蚀性气氛中,需对封装和焊点采取额外保护措施以提升可靠性。

四、焊接与装配注意事项

  • 焊接兼容性:端子镀锡并符合 J-STD-002 与 JESD22-B102,可用于常见波峰焊/回流焊工艺。但仍应遵循制造商给出的最大回流温度与时间曲线,避免过热。
  • 极性识别:装配时以色带为阴极标识,避免极性接反导致器件损坏或电路功能异常。
  • 机械应力:在手工焊接或修理时避免对封装施加过大机械应力,防止引线或封装裂纹。

五、选型与替代考虑

选型时应综合考虑最大反向电压余量、工作电流与散热条件。若系统存在更高的瞬时浪涌或更高工作温度需求,应考虑额定 Ifsm 更高或具有更低正向压降的替代器件。GS5M 适合在 1 kV 等级且持续电流约 5 A 的大多数中高压应用中作为首选或备选件。

品牌信息:

  • 生产商:BORN(伯恩半导体)
  • 封装:SMC(DO-214AB)

如需详细电气特性曲线、热阻数据或封装尺寸图,请参考厂商完整数据手册或联系供应商获取正式技术资料。

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