WMSIC Electronic Components

BORN BZT52C20S

ModelBZT52C20S
PackageSOD-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BZT52C20S
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BZT52C20S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.026g
Electronic Component
1
(Zzk)
225Ω
(Zzt)
55Ω
Electronic Component
BM0264900536
Diode
1
Current(Ir)
100nA@14V
Power Dissipation(Pd)
200mW
Electronic Component
18.8V~21.2V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C20S — 20V 200mW SOD-323 稳压二极管(BORN)

一、产品概述

BZT52C20S 为伯恩半导体(BORN)出品的一颗独立式稳压二极管,采用 SOD-323 表面贴装封装。该器件标称稳压值 20V、最大耗散功率 200mW,适合在空间受限的电路中提供简洁的参考电压或过压钳位保护。封装小巧、可靠性高,适用于工业控制、通信终端、小型电源模块等需要中低功率稳压或浪涌吸收的场合。

二、主要电气参数

  • 稳压值(标称):20V
  • 稳压值范围:18.8V ~ 21.2V(出厂分选范围,约±6%)
  • 反向电流 Ir:100nA @ 14V(低电压下的反向泄漏)
  • 耗散功率 Pd:200mW(芯片最大耗散,注意热管理)
  • 阻抗 Zzt:55Ω;阻抗 Zzk:225Ω(不同测试条件下的动态阻抗,影响稳压精度)
  • 配置:1 个独立二极管,SOD-323 表面贴装

说明:器件最大允许电流可由 Pd / Vz 估算,按 Pd=0.2W、Vz=20V 得到约 Iz_max ≈ 10mA;实际应用中通常选用远小于此的工作电流以降低温升并获得更稳定的稳压值。

三、性能特点

  • 小体积 SOD-323 封装,便于高密度表贴组装;
  • 低反向泄漏,有利于低电流偏置及高阻电路;
  • 中等动态阻抗(Zzt、Zzk),在小电流或变化电流时仍能提供合理稳压;
  • 标称 20V 稳压,适合对电压要求不极其苛刻的参考或保护用途。

四、典型应用

  • 参考电压源与基准电路(低成本方案);
  • 过压钳位与瞬态吸收(对电压尖峰进行限幅);
  • 偏置电路、检测与信号夹持;
  • 小型电源模块、便携设备及各类消费或工业电子产品。

五、设计与使用建议

  • 热管理:由于 Pd 仅 200mW,需在 PCB 设计中通过铜箔散热、减小环境温升及适当布局来降低结温;若接近最大耗散,应限制持续电流 ≤ ~10mA 并考虑更大功率件。
  • 稳定性:受动态阻抗影响,电流变化会引起稳压微幅波动。若需高精度参考,请在合适工作点引入稳定电流源或采用更低阻抗的参考源。
  • 焊接与包装:SOD-323 为常见贴片封装,建议按制造商给出的回流焊工艺曲线操作并注意防潮保存。
  • 测试与选型:出于精度需求,应关注批次稳压范围(18.8–21.2V),必要时向供应商索取分档件或进行筛选。

六、注意事项

  • 避免长期在接近 Pd 条件下工作以防止器件老化;
  • 高温环境下漏流和稳压值可能随温度漂移,使用前请在目标温度范围内验证;
  • 对可靠性或关键应用,建议结合厂方完整数据表与应用笔记进行最终设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.