WMSIC Electronic Components

BORN SMDJ33CA

ModelSMDJ33CA
PackageSMC(DO-214AB)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMDJ33CA
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMDJ33CA
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.37g
Electronic Component
1
Electronic Component
BM0265619047
Operating Temperature
55℃~+150℃
Voltage
53.3V
Current(Ir)
1uA
Voltage(VBR)
40.6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMDJ33CA 瞬态抑制二极管(TVS)产品概述

一、产品基本定位与核心属性

SMDJ33CA是伯恩半导体(BORN)针对电子电路瞬态过压防护需求推出的双向瞬态抑制二极管(TVS)。作为核心防护器件,它的核心功能是在电路遭遇雷电浪涌、开关瞬态或静电放电时,快速导通并钳位电压至安全范围,避免后端敏感元件(如IC、传感器)被击穿或烧毁。

其核心属性包括:

  • 双向极性设计(无需区分正负极,安装便捷);
  • SMC(DO-214AB)表面贴装封装(体积小、适配高密度PCB);
  • -55℃~+150℃宽工作温度(覆盖工业级及部分汽车级环境);
  • 符合RoHS环保标准(无铅无卤)。

二、关键电气参数深度解析

SMDJ33CA的电气参数精准匹配防护需求,核心参数及意义如下:

1. 反向截止电压(Vrwm=33V)

正常工作时允许施加的最大反向电压,在此电压下器件处于截止状态,反向漏电流极小(仅1μA),不会干扰电路正常功能。

2. 钳位电压(53.3V)

浪涌发生时,器件快速导通后将电压钳位至该值,远低于多数敏感元件的损坏阈值(通常≥60V),是防护效果的核心指标。

3. 峰值脉冲电流(Ipp=56.3A@10/1000μs)

“10/1000μs”是浪涌波形的标准测试条件(电流波上升时间10μs,半峰值持续时间1000μs),56.3A的耐受能力可覆盖多数工业/通信场景的浪涌冲击。

4. 峰值脉冲功率(Ppp=3kW@10/1000μs)

由钳位电压与脉冲电流共同决定(P=V×I),3kW功率耐受度验证了器件可承受的浪涌能量上限,适配高功率浪涌场景。

5. 击穿电压(40.6V)

器件从截止转为导通的临界电压,比反向截止电压高7.6V,确保正常工作时不导通,仅在浪涌电压超过该值时快速响应(响应时间≤1ns)。

6. 反向漏电流(Ir=1μA)

正常工作状态下的反向电流极低,不会增加电路功耗或干扰信号,保障电路稳定性。

三、封装与可靠性设计特点

SMDJ33CA采用SMC(DO-214AB)表面贴装封装,具备以下优势:

  1. 体积小巧:尺寸约6.9mm×5.9mm×2.3mm,适合高密度PCB布局,节省安装空间;
  2. 焊接可靠:符合IPC标准,支持回流焊、波峰焊等常规工艺,批量生产一致性好;
  3. 双向安装:无需区分正负极,降低生产出错率,提升组装效率;
  4. 环境适应性强:封装材料具备优异热稳定性与机械强度,可承受温度循环、振动等工业现场应力。

四、品牌与品质保障

伯恩半导体(BORN)是国内专注功率半导体及防护器件的专业厂商,SMDJ33CA的品质管控严格遵循国际标准:

  • 可靠性测试:通过温度循环(-55℃~+150℃,1000次)、湿度测试(85℃/85%RH,1000小时)、浪涌冲击(重复施加标准波形)等多重验证;
  • 汽车级可选:部分批次符合AEC-Q101标准,适配汽车电子场景;
  • 环保合规:符合RoHS、REACH等全球环保法规,满足出口需求。

五、典型应用场景

SMDJ33CA的防护能力覆盖多领域,核心应用包括:

  1. 工业控制:PLC、传感器模块、电机驱动电路,防护雷电浪涌与开关瞬态;
  2. 汽车电子:车载CAN总线、胎压监测传感器、电源接口,适应-40℃~+125℃车规温度;
  3. 通信设备:基站、路由器、交换机的以太网端口/电源输入,防护线路浪涌与静电;
  4. 消费电子:笔记本电脑、显示器的电源/USB端口,防护静电及插拔浪涌;
  5. 医疗设备:监护仪、输液泵的信号/电源电路,保障精密设备可靠性。

六、总结

SMDJ33CA凭借精准电压钳位、大脉冲耐受、宽温范围及双向便捷安装,成为电子设备过压防护的可靠选择。它可有效抵御瞬态浪涌对敏感元件的损坏,提升设备稳定性与使用寿命,广泛适配工业、汽车、通信等多领域需求。

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