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BORN SMFJ70A
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMFJ70A
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMFJ70A
- Electronic Component
- 1
- Package
- SOD-123F
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0264692219
- Voltage
- 113V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 86V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMFJ70A — 70V 单向 TVS 二极管 产品概述
一、产品简介
SMFJ70A 是 BORN（伯恩半导体）推出的一款单向瞬态电压抑制（TVS）二极管，面向电源口和信号电缆的浪涌、雷击及开关过压保护。该器件以 70V 的反向工作电压（Vrwm）为基准设计，适用于需在中高压直流环境下提供浪涌吸收的应用场景，体积小、响应快，常用作电源输入端保护元件。
二、关键电气参数
- 极性：单向
- 反向工作电压 Vrwm：70 V
- 击穿电压 VBR：86 V（典型）
- 钳位电压 Vc：113 V（在峰值脉冲电流 Ipp 条件下测得）
- 峰值脉冲电流 Ipp：1.5 A
- 峰值脉冲功率 Ppp：200 W（波形 10/1000 μs）
- 反向漏电流 Ir：1 μA（在 Vrwm 条件下为典型小漏）
- 封装：SOD-123F
（注：钳位电压为在规定脉冲条件下的典型值，实际值与测试条件和电路布局有关。）
三、主要特性与优势
- 单向结构，对直流电源线抑制效果优异，响应速度快。
- 低漏电流，有利于在高阻耗系统中维持正常工作电平。
- 支持 200W（10/1000 μs）短时能量吸收，能应对典型的开关瞬态与雷击脉冲。
- 小型 SOD-123F 封装，适合自动贴装与回流焊工艺，占板面积小。
- 钳位电压合理，能在保护器件和被保护电路之间实现良好折衷。
四、典型应用场景
- 开关电源输入端防护（48V/54V 类系统）
- 通信设备与基站的电源口、入户线缆保护
- 工业设备、控制器、测控模块的浪涌防护
- 消费类电子中需抑制瞬态过压的电源与接口电路
五、封装与 PCB 布局建议
- 将 SMFJ70A 靠近被保护的输入端或连接器安放，以减少回路电感与走线长度，从而提升钳位效果。
- 尽量使用宽铜连接线并在器件热端对面采用散热铜箔或热孔（thermal via）以帮助热量扩散。
- 对于高能量脉冲场合，检查焊盘和走线的机械强度与散热能力，必要时并联多个器件或选用更高功率元件。
- 回流焊温度曲线遵循封装供应商推荐，避免过高温度造成封装应力。
六、选型与使用注意事项
- 工作电压应低于 Vrwm（70 V）并留有安全裕量，避免长期在 Vrwm 附近运行以减少温升与漏电。
- 钳位电压是在指定脉冲电流下的测得值，实际电路中的 PCB 布局、电源阻抗等都会影响最终钳位效果。
- 若系统可能遭受高于 Ipp 能力的冲击，应考虑并联、级联或选用更高功率等级的 TVS 器件。
- 单向器件需正确识别极性，负极接地或参考电位，正极面向受保护电路的电源输入方向。
七、品牌与采购
产品型号：SMFJ70A；品牌：BORN（伯恩半导体）；常见包装形式为贴片卷盘（适配自动化贴装）。在设计与采购时建议索取完整数据手册以确认温度特性、稳态功耗、冲击测试条件及可靠性数据，以便在目标应用中进行充分验证。
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