WMSIC Electronic Components

BORN BAV99W

ModelBAV99W
PackageSOT-323
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN BAV99W
Type
BORN
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
BAV99W
Electronic Component
1
Package
SOT-323
Electronic Component
Switch Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0264682179
Current
200mA
Current(Ir)
2.5uA
(Vf)
1.25V@150mA
Electronic Component
40℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
70V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAV99W 产品概述

BAV99W 是一款面向通用快速开关应用的表面贴装小信号二极管,适用于高速开关、限幅、整流与电平移位等电路。由 BORN(伯恩半导体)生产,采用 SOT-323 小封装,适合自动贴装与高密度 PCB 设计,提供稳定的电气性能与良好的可靠性。

一、主要特性

  • 快速开关速度,反向恢复时间 Trr:6 ns,适合高频开关场景。
  • 直流反向耐压 Vr:70 V,满足中低压耐压需求。
  • 正向压降 Vf:1.25 V(@150 mA),导通损耗小。
  • 整流电流 If(av):200 mA,支持中等电流的信号整流与开关。
  • 非重复峰值浪涌电流 Ifsm:2 A,应对瞬态冲击能力良好。
  • 反向电流 Ir:2.5 μA,低漏电利于高阻抗或精密场合。
  • 工作结温范围:-40 ℃ ~ +125 ℃,适合工业级温度要求。

二、电气参数要点

  • 低正向压降与较高导电性,利于降低功耗与热量积累。
  • 低反向电流在传感器输入、模拟开关等场合有优势。
  • 70 V 的反向耐压覆盖常见通信、电源前端与信号保護需求。

三、封装与机械

  • 封装类型:SOT-323(小型表面贴装),适合自动贴装流水线。
  • 小体积有利于高密度布局,但需注意散热通道与热阻管理。

四、典型应用场景

  • 高速逻辑开关、波形整形与门限电平移位。
  • 信号整流、夹位保护、反向极性保护。
  • 通信终端、功率管理电路、便携设备的输入保护与开关。
  • 模拟前端与混合信号电路中的快速开关元件。

五、布局与工程建议

  • 贴片焊盘应按厂商推荐尺寸设计,焊盘过大或过小均影响焊接质量。
  • 若在高电流或高频场合使用,考虑在管脚附近保留散热铜箔并采用过孔接地/散热。
  • 对于精密模拟电路,注意反向漏电对偏置点的影响,必要时并联更低漏电元件或增加旁路电路。
  • 组装与回流焊工艺应遵循 SMD 温度曲线以保证焊接可靠性。

六、可靠性与选型注意

  • 推荐在实际温度与频率条件下验证 Trr、Vf 随温度变化的性能。
  • 如果应用中存在更高的瞬态冲击或电流需求,应选择更高 Ifsm 或增加保护元件。
  • 采购时确认批次并注意封装代码,确保与 PCB 设计一致。

BAV99W 以其快速开关、低漏电、高导电与小型化封装,适合多种通用开关与信号处理场景,是需要在体积受限处实现高速切换与保护功能时的实用选择。若需进一步的封装尺寸图、热阻数据或频率响应曲线,可联系供应商或索取完整数据手册。

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