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BORN BZT52C24S
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN BZT52C24S
- Type
- BORN
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- BZT52C24S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- (Zzk)
- 250Ω
- (Zzt)
- 70Ω
- Electronic Component
- BM0228561624
- Diode
- 1
- Current(Ir)
- 100nA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 22.8V~29V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C24S 产品概述
一、概述
BZT52C24S 是 BORN（伯恩半导体）推出的一款独立式小功率稳压二极管，标称稳压值为 24V。该器件以 SOD-323 超小封装为载体，适用于对空间、成本、功耗有严格要求的电子设计中，常用作基准稳压、过压保护、基线偏置或微小电流下的电压钳位元件。
二、主要参数
- 标称稳压（VZ）：24V
- 稳压值分选范围：22.8V ~ 25.6V（个别资料标注可至 29V，具体以出厂规格书为准）
- 阻抗 Zzk：250Ω
- 阻抗 Zzt：70Ω
- 反向电流 Ir：100nA（在 16.8V 时测得）
- 耗散功率 Pd：200mW（SOD-323 封装热耗散限制）
- 二极管配置：独立式（单只器件）
- 封装：SOD-323，小型贴片
三、结构与封装特点
SOD-323 封装体积小、焊接方便，适合自动贴片生产线。因封装极小，器件的热阻较大，最大耗散功率受 PCB 铜箔面积和散热条件限制。器件外形通常带有极性标记（阴极环），焊接时注意方向性。
四、典型应用场景
- 精密小电流条件下的基准稳压与偏置电路；
- 小型传感器、电池管理与便携设备中的电压钳位；
- 输入电源的过压保护与信号线保护（低能量）；
- 测试与校准电路中作为固定参考源。
五、设计与使用注意事项
- 电流与稳压关系：BZT52C24S 为稳压（齐纳）二极管，需要通过串联限流电阻在规定电流点工作以维持稳定电压。
- 功耗与散热：封装最大耗散 200mW，实际电流与电压乘积不得超过此值，并需考虑 PCB 的散热能力，必要时增加铜箔或热沉。
- 纹波与阻抗：器件在不同测试电流下阻抗（Zzk、Zzt）不同，若要求低输出纹波，应选择工作点使阻抗较低。
- 反向漏流：在低电压条件下（如 16.8V）漏电流可达到 100nA，长期偏置或高温下漏电会增加，需在电路中考虑漏电对精度的影响。
- 不适合大能量冲击：该器件不是高能量 TVS，遇到大浪涌或尖峰需要选用专用瞬态抑制器。
六、选型与采购建议
- 确认稳压分选范围与批次一致性，关键应用建议索取出厂检验报告或更严格分选等级；
- 若需更高功率或浪涌能力，考虑更大封装或专业 TVS 产品；
- 采购时注意包装形式（卷带/托盘）、批次和储存条件，避免潮湿导致焊接缺陷。
七、可靠性与测试提示
- 建议在目标电路温度范围内进行稳压点、漏电流和功率耗散验证；
- 进行热循环、焊接热挑战（回流）及长期老化试验，以评估在实际工况下的稳定性；
- 对于关键参考用途，建议以多件筛选并做漂移测试，确保长期精度。
总结：BZT52C24S 以小体积、低漏电和合适的稳压特性，适合低功耗、空间受限的应用场景。设计时重点关注工作电流点、功耗限值和散热条件，以保证器件在预期工况下长期稳定可靠。
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