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BORN SS310SMC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SS310SMC
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- SS310SMC
- Electronic Component
- 1
- Package
- SMC
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.351g
- Electronic Component
- 1
- Electronic Component
- BM0264222529
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 200uA@100V
- (Vf)
- 850mV@3A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 100V
- Surge Current (Ifsm)
- 150A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS310SMC 产品概述
一、产品简介
SS310SMC 是伯恩半导体（BORN）推出的一款独立式肖特基整流二极管，采用 SMC 封装，额定整流电流为 3A，反向耐压 100V，正向压降标称为 850mV（在 3A 时）。凭借肖特基二极管的低正向压降与快速恢复特性，SS310SMC 适用于中功率整流与保护电路，特别在开关电源、DC-DC 变换器与续流回路中表现稳定可靠。
二、主要参数（典型/额定）
- 二极管类型：肖特基二极管（独立式）
- 正向压降 Vf：850mV @ IF = 3A
- 直流反向耐压 Vr：100V
- 额定整流电流 IF(AV)：3A
- 反向电流 Ir：200μA @ VR = 100V
- 非重复峰值浪涌电流 Ifsm：150A
- 工作结温范围：-65°C ~ +150°C
- 封装：SMC（适合表面贴装、大功率散热需求）
三、主要特性与优势
- 低正向压降：在中等电流下（3A）仅约 0.85V，可减小整流损耗，提高效率，尤其适合高频开关场合。
- 高频性能好：肖特基特性使得反向恢复时间极短，适合集成于开关电源与高频整流器中，降低电磁干扰与开关损耗。
- 高浪涌承受能力：150A 的峰值浪涌能力保证了在启动与冲击负载时的可靠性。
- 宽温度范围：-65°C ~ +150°C 的结温范围满足工业级与苛刻环境的使用要求。
四、典型应用场景
- 开关电源（SMPS）输出整流与续流二极管
- DC-DC 转换器中高效整流
- 反向极性保护电路与电池充放电管理
- 逆变器与电机驱动回路中的快速回流保护
- 汽车电子与工业控制（需注意工作温升与反向泄漏随温度增长）
五、设计与使用注意事项
- 反向泄漏随温度上升明显增加，设计时应考虑工作环境温度与热阻，必要时增加散热铜箔或散热器，推荐在 PCB 布局时扩大焊盘面积以降低结温。
- 封装为 SMC，适合自动贴装与波峰/回流焊，但在波峰焊时注意温度曲线以避免热应力。
- 在高浪涌工况下，应评估重复冲击对寿命的影响，并根据 Ifsm 与脉冲宽度做合理的安全裕量设计。
- 虽为肖特基结构，但在反向耐压与泄漏电流要求高的场合（如高阻输入）需谨慎选型。
六、可靠性与采购建议
SS310SMC 提供工业级工作温度与较高浪涌承受能力，适合大多数中功率整流与保护场合。选购时建议参考伯恩半导体提供的完整数据手册，确认温升曲线、最大结温、热阻（RθJA/RθJC）及封装尺寸，以便在 PCB 设计和热管理上做出准确判断。若需替代，注意匹配正向压降、反向耐压、浪涌能力与封装尺寸。
结语：SS310SMC 以其 3A 电流能力、100V 耐压和较低的正向压降，成为开关电源与整流应用中性价比较高的选择。购买与技术支持请联系 BORN（伯恩半导体）或其授权分销渠道，并参考正式数据表以完成最终设计验证。
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