WMSIC Electronic Components

BORN SMDJ26A

ModelSMDJ26A
PackageDO-214AB
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMDJ26A
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMDJ26A
Electronic Component
1
Package
DO-214AB
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.39g
Electronic Component
1
Electronic Component
BM0264602974
Voltage
42.1V
Current(Ir)
1uA
Voltage(VBR)
28.9V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMDJ26A(VRWM=26V)产品概述

一、产品简介

SMDJ26A 是 BORN(伯恩半导体)推出的一款单向(Unipolar)瞬态电压抑制二极管(TVS),封装为 DO-214AB(俗称 SMB),专为对电源线和信号线的浪涌及雷击脉冲保护而设计。该型号标称稳态工作反向电压 VRWM = 26V,能在 10/1000µs 波形下提供高达 3000W 的峰值脉冲功率,适用于工业电源、通信设备、开关电源以及一般电子设备的过压防护。

二、主要电气参数

  • 极性:单向(Unipolar)
  • 反向截止电压(VRWM):26V
  • 击穿电压(VBR):28.9V
  • 钳位电压(VCL):42.1V(典型)
  • 峰值脉冲电流(Ipp):71.3A(基于 10/1000µs)
  • 峰值脉冲功率(Ppp):3000W @ 10/1000µs
  • 反向静态电流(IR):1µA(在 VRWM 条件下典型)
  • 封装:DO-214AB(SMB)

以上参数为典型值/参考值,具体数值请参照厂方数据手册中温度、波形与测量条件下的完整曲线和极限值。

三、关键特性与优势

  • 高能量吸收:在 10/1000µs 浪涌下 3kW 能量能力,适合雷击及高能脉冲场景。
  • 低漏电流:典型 IR 仅 1µA,可用于对待机漏电敏感的系统。
  • 低钳位:42.1V 的典型钳位电压,在 26V 额定系统中能有效限制过电压至可接受范围,保护后端元件。
  • 表面贴装 SMB 封装:利于自动化贴装与回流焊工艺,散热和机械强度兼顾。

四、典型应用场景

  • 工业电源与配电模块的浪涌保护
  • 通信基站、交换设备的线路防护
  • 电机驱动、逆变器等含感性负载设备的过电压抑制
  • 电池管理与充电设备的输入端保护
  • 需要高能量脉冲承受能力的防雷应用

五、选型与使用注意事项

  • 工作电压匹配:选择 VRWM 稍高于系统正常工作电压(一般留 10%~20% 余量),以避免在正常瞬态下触发 TVS。
  • 钳位考量:确认 VCL(钳位电压)在浪涌情况下是否低于被保护器件的最大承受电压。
  • 脉冲能力与重复性:Ppp=3kW 指单次/标准波形能力;频繁或重复脉冲需按能量累积和器件热阻做降额设计。
  • 单向器件适用于直流或带明显极性的电路;若需对交流双向保护,应选用双向(Bidirectional)TVS。
  • 热管理:确保 PCB 有良好铜箔散热和恰当的焊盘布局,避免热集聚影响可靠性。

六、封装与可靠性建议

  • DO-214AB(SMB)为中等功率 SMD 封装,支持常规回流焊。但推荐遵循厂方回流温度曲线,避免超温或过长加热时间。
  • 贴装时保持焊盘清洁,采用合适焊膏量与焊盘尺寸,保证热传导与机械强度。
  • 储存与静电防护:在生产与装配中采取防静电措施(ESD 防护),并避免潮湿环境长期存放。

七、包装与采购建议

  • 量产时建议索取完整数据手册与典型浪涌试验曲线,必要时请求厂方提供样片进行实际系统测试。
  • 订购时确认品牌型号(BORN 伯恩半导体 SMDJ26A)、封装(DO-214AB/SMB)及是否有合格的出厂检验报告或可靠性测试记录。

总结:SMDJ26A 以其 26V 的驻留电压、42.1V 的典型钳位与 3kW 的高脉冲吸收能力,适合需要高能量浪涌防护的中高压 DC 应用。选型时重点关注工作电压匹配、钳位要求和热管理设计,以确保长期可靠运行。

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