WMSIC Electronic Components

BORN SMDJ33A

ModelSMDJ33A
PackageSMC
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMDJ33A
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMDJ33A
Electronic Component
1
Package
SMC
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.37g
Electronic Component
1
Electronic Component
BM0264900537
Voltage
53.3V
Current(Ir)
2uA
Voltage(VBR)
40.6V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMDJ33A TVS 瞬态抑制二极管(单向)产品概述

一、产品简介

SMDJ33A 为 BORN(伯恩半导体)出品的单向 TVS(瞬态电压抑制)二极管,采用 SMC 封装,专为保护直流电源轨和敏感电子器件免受雷击、开关瞬态和浪涌干扰设计。器件具有玻璃钝化芯片与环氧树脂封装工艺,兼顾高可靠性与工业级抗浪涌能力。

二、主要参数概述

  • 极性:单向
  • 反向截止电压 Vrwm:33 V(稳态工况最大耐受电压)
  • 击穿电压 VBR:40.6 V(典型)
  • 钳位电压:53.3 V(在额定脉冲条件下)
  • 峰值脉冲电流 Ipp:56.3 A(对应 10/1000 μs 波形)
  • 峰值脉冲功率 Ppp:3 kW @ 10/1000 μs
  • 反向泄漏电流 Ir:2 μA(在 Vrwm 条件下)
  • 类型:TVS,封装:SMC

三、关键特性与优势

  • 优秀的钳位能力:在高能脉冲作用下将过电压快速钳制到安全水平,保护下游器件。
  • 低泄漏电流:Vrwm 下漏电小,适合对待机功耗敏感的系统。
  • 低电容:对高速信号影响小,适用于包含数据或通信子系统的应用。
  • 高浪涌能力:3 kW@10/1000 μs 波形,能承受常见的雷击及浪涌事件。
  • 玻璃钝化芯片:提升稳定性和可靠性,减少电气老化。
  • SMC 封装:便于波峰/回流焊装配与散热管理,适合批量生产。

四、典型应用场景

  • 电信设备:基站电源保护、端口防护、交换设备电源输入。
  • 计算机与服务器:主板电源轨、外设接口和电源入口的浪涌抑制。
  • 工业控制与自动化:24 V/48 V DC 总线防护、电源模块保护。
  • 其他需要高能量瞬态抑制的场合。

五、设计与使用建议

  • 将器件并联于需保护的电源线上:单向器件正极接电源正,负极接地。
  • PCB 布局:抑制器附近布置尽可能短、粗的走线到地;使用单点接地或短回流路径以减小寄生电感。
  • 热管理:SMC 封装可散热,但在高频繁浪涌场合建议在布局上提供足够铜箔散热面积或使用散热平面。
  • 配合器件:在高能量事件下可与熔断器、限流电阻或开关元件配合使用以提高系统整体可恢复性。
  • 使用限制:TVS 为瞬态保护器件,不作连续稳压器使用;超过其额定能量和重复冲击能力会降低寿命。

六、可靠性与封装信息

SMDJ33A 采用玻璃钝化芯片与环氧树脂封装,提供良好的环境稳定性和抗湿热能力。标准 SMC(DO-214AB)封装适配自动贴装与回流焊流程,便于生产线集成。常见的可靠性验证包括潮湿热循环、ESD 与浪涌试验,应按系统级要求进行验证。

七、采购与支持

BORN(伯恩半导体)品牌,型号 SMDJ33A,封装 SMC。如需样片、详细器件曲线(I-V、钳位特性)、封装图或应用手册,建议联系厂商技术支持获取原厂数据手册,以便进行精确的热和电气设计验证。

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